via
所属分类：硬件设计
开发工具：HFSS
文件大小：5549KB
下载次数：5
上传日期：2018-06-25 21:15:21
上 传 者：
小均均君
说明： 在高速信号传输的过程中经常会出现因为PCB板布局空间和结构的限制而造成必须使用过孔传输信号。而过孔在高频信号中等价于一个pi型磁珠。会对信号在一段频带内产生传输上的损耗（插入损耗变差）这里的模型给出HFSS对于过孔的信号传输仿真，很有工程意义，值得深入探究和学习。
(In the process of high-speed signal transmission, it often happens that the signal must be transmitted through the via because of the limitation of the space and structure of the PCB layout. The vias are equivalent to a pi-type bead at high frequency signals. The transmission loss of the signal in a band (insertion loss is degraded) will be given here. The model gives HFSS simulation of signal transmission through vias. It is of engineering significance and worthy of further exploration and learning.)
文件列表:
via (0, 2018-06-25)
via\Via_wavep.hfss (122419, 2017-02-24)
via\Via_wavep.hfssresults (0, 2018-06-25)
via\Via_wavep.hfssresults\HFSSDesign1.asol (9150, 2017-02-24)
via\Via_wavep.hfssresults\ManagedFiles_Design0.asol (196, 2017-02-24)
via\Via_wavep.hfssresults\mf_0 (0, 2018-06-25)
via\Via_wavep.hfssresults\mf_0\fldplt (0, 2018-06-25)
via\Via_wavep.hfssresults\mf_0\fldplt\Plot0.tmp (70741, 2017-02-24)
via\Via_wavep.hfssresults\mf_0\GeometryCache (0, 2018-06-25)
via\Via_wavep.hfssresults\mf_0\GeometryCache\BodyCache (0, 2018-06-25)
via\Via_wavep.hfssresults\mf_0\GeometryCache\BodyCache\0000006.fct (7204, 2017-02-24)
via\Via_wavep.hfssresults\mf_0\GeometryCache\BodyCache\0000006.sab (11225, 2017-02-24)
via\Via_wavep.hfssresults\mf_0\GeometryCache\BodyCache\0000090.fct (10100, 2017-02-24)
via\Via_wavep.hfssresults\mf_0\GeometryCache\BodyCache\0000207.fct (13828, 2017-02-24)
via\Via_wavep.hfssresults\mf_0\GeometryCache\BodyCache\0000207.sab (19905, 2017-02-24)
via\Via_wavep.hfssresults\mf_0\GeometryCache\InterrogationCache.tmp (2829, 2017-02-24)
via\Via_wavep.hfssresults\mf_0\GeometryCache\OperationDataCache.tmp (12, 2017-02-24)
via\Via_wavep.hfssresults\mf_0\radfld (0, 2017-02-24)
via\Via_wavep.hfssresults\mf_0\radfld\RAD915982014875946821.tmp (144, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults (0, 2018-06-25)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.asol (8008, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results (0, 2018-06-25)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_MI0_V325.sd (0, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_MI0_V325.sd\initial.stats (1297, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_MI0_V325.sd (0, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_MI0_V325.sd\current.stats (1297, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_V325.cmesh (0, 2018-06-25)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_V325.cmesh\current.fac (472091, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_V325.cmesh\current.hyd (802989, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_V325.cmesh\current.lin (52111, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_V325.cmesh\current.pnt (91734, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_V325.cmesh\current.sld (202, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_V325.cmesh\current.stats (1297, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S59_V325.profile (7788, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S61_V325_F310 (0, 2018-06-25)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S61_V325_F310\4.nvc (317, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S61_V325_F310\4_1.tvc (16641, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S61_V325_F310\4_1.tvm (2464, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S61_V325_F310\4_1.tvz (16640, 2017-02-24)
via\Via_wavep.hfssresults\Via_lumpport.hfssresults\HFSSDesign1.results\DV254_S61_V325_F310\5.nvc (323, 2017-02-24)
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