CH376模块U盘读写-STM32F103
所属分类：单片机开发
开发工具：C/C++
文件大小：4522KB
下载次数：0
上传日期：2021-02-02 16:16:59
上 传 者：
SSC88
说明： 基于STM32F103ZET的U盘读写，使用CH376模块，通过SPI2进行通信
(Based on stm32f103zet U disk read and write, using CH376 module, through SPI2 communication)
文件列表:
CH376模块U盘读写-STM32F103 (0, 2020-09-14)
CH376模块U盘读写-STM32F103\CORE (0, 2020-09-14)
CH376模块U盘读写-STM32F103\CORE\core_cm3.c (17273, 2010-06-07)
CH376模块U盘读写-STM32F103\CORE\core_cm3.h (85714, 2011-02-09)
CH376模块U盘读写-STM32F103\CORE\startup_stm32f10x_hd.s (15503, 2011-03-10)
CH376模块U盘读写-STM32F103\HARDWARE (0, 2020-09-14)
CH376模块U盘读写-STM32F103\HARDWARE\CH376 (0, 2020-09-16)
CH376模块U盘读写-STM32F103\HARDWARE\CH376\CH376INC.H (39785, 2008-10-28)
CH376模块U盘读写-STM32F103\HARDWARE\CH376\FILE_SYS.C (36622, 2020-09-16)
CH376模块U盘读写-STM32F103\HARDWARE\CH376\FILE_SYS.H (7099, 2020-09-16)
CH376模块U盘读写-STM32F103\HARDWARE\KEY (0, 2020-09-14)
CH376模块U盘读写-STM32F103\HARDWARE\KEY\key.c (1827, 2015-03-20)
CH376模块U盘读写-STM32F103\HARDWARE\KEY\key.h (1186, 2015-03-19)
CH376模块U盘读写-STM32F103\HARDWARE\LED (0, 2020-09-14)
CH376模块U盘读写-STM32F103\HARDWARE\LED\led.c (1298, 2012-09-13)
CH376模块U盘读写-STM32F103\HARDWARE\LED\led.h (638, 2012-09-13)
CH376模块U盘读写-STM32F103\HARDWARE\SPI (0, 2020-09-14)
CH376模块U盘读写-STM32F103\HARDWARE\SPI\spi.c (3380, 2020-09-14)
CH376模块U盘读写-STM32F103\HARDWARE\SPI\spi.h (718, 2012-09-16)
CH376模块U盘读写-STM32F103\HARDWARE\SPI_CH376 (0, 2020-09-17)
CH376模块U盘读写-STM32F103\HARDWARE\SPI_CH376\spi_ch376.c (7113, 2020-09-17)
CH376模块U盘读写-STM32F103\HARDWARE\SPI_CH376\spi_ch376.h (1641, 2020-09-17)
CH376模块U盘读写-STM32F103\keilkilll.bat (399, 2011-04-23)
CH376模块U盘读写-STM32F103\OBJ (0, 2020-09-17)
CH376模块U盘读写-STM32F103\OBJ\core_cm3.crf (3939, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\core_cm3.d (101, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\core_cm3.o (11360, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\debug.d (82, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\delay.crf (349952, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\delay.d (1666, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\delay.o (383260, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\file_sys.crf (377271, 2020-09-17)
CH376模块U盘读写-STM32F103\OBJ\file_sys.d (1875, 2020-09-17)
CH376模块U盘读写-STM32F103\OBJ\file_sys.o (415580, 2020-09-17)
CH376模块U盘读写-STM32F103\OBJ\key.crf (350472, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\key.d (1637, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\key.o (384184, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\lcd.crf (384317, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\lcd.d (1827, 2020-09-14)
CH376模块U盘读写-STM32F103\OBJ\lcd.o (456076, 2020-09-14)
... ...
2020.9.15
1. 阶段性成果打包，SD卡基本读写操作；
2. F1开发板SPI2时钟频率36MHz，目前2分频为18Mhz（CH376模块的SPI最高可设置到24MHz）。数组缓冲区越大传输速率越快，打包大小为512字节时速度达到最快（1024字节时没有明显加快），18MHz时钟下约为70~80kB/s.
3. 降低时钟频率会导致传输速率下降，8分频时约为60+kB/s，16分频时约为50+kB/s.
4. SPI1时钟频率最高可达到72MHz
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