文件列表:

BLE-CC254x_v1.4.0 (0, 2014-07-21)
BLE-CC254x_v1.4.0\Accessories (0, 2014-07-21)
BLE-CC254x_v1.4.0\Accessories\BTool (0, 2014-07-21)
BLE-CC254x_v1.4.0\Accessories\BTool\BTool_Setup.msi (697344, 2013-10-31)
BLE-CC254x_v1.4.0\Accessories\BTool\setup.exe (428032, 2013-02-20)
BLE-CC254x_v1.4.0\Accessories\Drivers (0, 2014-07-21)
BLE-CC254x_v1.4.0\Accessories\Drivers\ccxxxx_usb_cdc.cat (10259, 2013-09-19)
BLE-CC254x_v1.4.0\Accessories\Drivers\ccxxxx_usb_cdc.inf (3408, 2013-06-07)
BLE-CC254x_v1.4.0\Accessories\HexFiles (0, 2014-07-21)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2540MiniDkDemoSlave.hex (309609, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2540_keyfob_SimpleBLEPeripheral.hex (298797, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2540_SmartRF_HostTestRelease_All.hex (422402, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2540_SmartRF_SimpleBLECentral.hex (327626, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2540_SmartRF_SimpleBLEPeripheral.hex (301275, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2540_USBdongle_HIDAdvRemoteDongle.hex (341896, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2540_USBdongle_HostTestRelease_All.hex (429443, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2541DK_BIM_SensorTagOadImgA.hex (362944, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2541MiniDkDemoSlave.hex (317571, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2541_ARC_HIDAdvRemote.hex (362437, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2541_keyfob_SimpleBLEPeripheral.hex (305364, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2541_SmartRF_HostTestRelease_All.hex (441593, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2541_SmartRF_SimpleBLECentral.hex (335980, 2013-11-08)
BLE-CC254x_v1.4.0\Accessories\HexFiles\CC2541_SmartRF_SimpleBLEPeripheral.hex (307894, 2013-11-08)
BLE-CC254x_v1.4.0\BLE_1.4_Manifest.pdf (16399, 2013-10-08)
BLE-CC254x_v1.4.0\Components (0, 2014-07-21)
BLE-CC254x_v1.4.0\Components\ble (0, 2014-07-21)
BLE-CC254x_v1.4.0\Components\ble\controller (0, 2014-07-21)
BLE-CC254x_v1.4.0\Components\ble\controller\include (0, 2014-07-21)
BLE-CC254x_v1.4.0\Components\ble\controller\include\ll.h (109731, 2013-08-15)
BLE-CC254x_v1.4.0\Components\ble\controller\include\ll_math.h (3370, 2011-02-17)
BLE-CC254x_v1.4.0\Components\ble\controller\include\ll_sleep.h (3958, 2013-02-27)
BLE-CC254x_v1.4.0\Components\ble\controller\include\ll_timer2.h (8683, 2012-07-13)
BLE-CC254x_v1.4.0\Components\ble\controller\include\phy.h (71293, 2013-10-22)
BLE-CC254x_v1.4.0\Components\ble\controller\include\phy_image.h (3683, 2013-01-30)
BLE-CC254x_v1.4.0\Components\ble\hci (0, 2014-07-21)
BLE-CC254x_v1.4.0\Components\ble\hci\hci_data.h (3816, 2013-09-30)
BLE-CC254x_v1.4.0\Components\ble\hci\hci_event.h (10076, 2012-08-24)
BLE-CC254x_v1.4.0\Components\ble\hci\hci_tl.h (14329, 2013-08-15)
BLE-CC254x_v1.4.0\Components\ble\host (0, 2014-07-21)
BLE-CC254x_v1.4.0\Components\ble\host\gatt_uuid.c (9819, 2013-09-26)
... ...

Texas Instruments, Inc. CC2540/41 Bluetooth Low Energy Software Development Kit Release Notes Version 1.4.0 November 8, 2013 Notices: - This version of the Texas Instruments BLE stack and software is a minor update to the v1.3.2 release. It contains some minor bug fixes and a few functional changes. - The BLE protocol stack, including both the controller and host, was completely retested for v1.4.0. Changes and Enhancements: - All projects have been migrated from IAR v8.10.4 to IAR 8.20.2. In order to build all projects, be sure to upgrade to IAR v8.20.2. - Updated SPI and UART_DMA drivers for improved robustness and throughput. - Added an overlapped processing feature to improve throughput and reduce power consumption in devices where peak power consumption isn't an issue. Overlapped processing allows the stack to concurrently process while the radio is active. Since the stack is concurrently processing, it is able to insert new data in the Tx buffer during the connection event, causing additional packets to be sent before the end of the event. - Added a Number of Completed Packets HCI command which offers the possibility of waiting for a certain number of completed packets before reporting to the host. This allows higher throughput when used with overlapped processing. - Added an HCI Extension command HCI_EXT_DelaySleepCmd which provides the user control of the system initialization sleep delay (wake time from PM3/boot before going back to sleep). The default sleep delay is based on the reference design 32 kHz XOSC stabilization time. - Added a low duty cycle directed advertising option. - Added support for deleting a single bond with the GAP_BondSetParam command. - Decreased CRC calculation time during OAD by using DMA. Bug Fixes: - Using a short connection interval and exercising high throughput, there was some loss of packets. This was fixed by adding host to application flow control support. - Bonding was unstable at short connection intervals. This is now fixed. - Fixed USB CDC Drivers to work with Windows 8. - OAD sample project would fail if long connection interval was used. This was fixed by not allowing parameter updates to the central device. - Fixed linking errors in UBL project. - Fixed minor issues in sample apps to work with PTS dongle. - Fixed USB descriptors in HostTestRelease to display correct string. Known Issues: - Use of the NV memory (to save application data or BLE Host bonding information) during a BLE connection may cause an unexpected disconnect. The likelihood of this happening increases with frequent usage, especially when using short connection intervals. The cause is related to the NV wear algorithm which at some point may cause an NV page erase which can disrupt system real-time processing. It is therefore recommended that the NV memory be used sparingly, or only when a connection is not active. - HCI packet size of 128 bytes or more will be disregarded by the stack, and as such, no HCI event will be returned. For technical support please visit the Texas Instruments Bluetooth low energy E2E Forum: http://e2e.ti.com/support/low_power_rf/f/538.aspx For additional sample applications, guides, and documentation, visit the Texas Instruments Bluetooth Low Energy wiki page at: http://processors.wiki.ti.com/index.php/Category:BluetoothLE ------------------------------------------------------------------------------- ------------------------------------------------------------------------------- Version 1.3.2 June 13, 2013 Notices: - This version of the Texas Instruments BLE stack and software is a minor update to the v1.3.1 release. It contains some minor bug fixes and a few functional changes. - The BLE protocol stack, including both the controller and host, was completely retested for v1.3.2. The profiles Running Speed and Cadence, Cycling Speed and Cadence, and Glucose were fully tested and passed certification. Other profiles with no code changes since 1.3.1 were sanity tested only. Changes and Enhancements: - Added Running Speed and Cadence profile and service. An example application demonstrating running speed and cadence is provided. - Added Cycling Speed and Cadence profile and service. An example application demonstrating cycling speed and cadence is provided. - Added delay before performing Connection Parameter changes. Implemented conn_pause_peripheral) and TGAP(conn_pause_central) timers as described in CSA 3 rev 2, Gap Connection Parameters Changes, Section 1.12. Updated HIDAdvRemote, HIDEmuKbd, KeyFob, SensorTag, and SimpleBLEPeripheral applications. - Update Privacy Flag and Reconnection Address characteristics permissions (Erratum 4202) - A new Windows USB CDC driver has been included in the installer. This new driver is signed and is functional on Windows 8 systems. Bug Fixes: - Some minor updates to glucose sensor and collector were made. - The gyroscope would draw continuous 6mA when enabled. The updated code now performs a read and turns off the gyro after 60ms. - The master’s host would accept invalid connection parameters requested by the Slave, and would send back the Connection Parameter Update Response with ‘parameters accepted’. The host now performs validation on these parameters. - When coming out of sleep, the HCI_EXT_ExtendRfRangeCmd would override HCI_EXT_SetRxGainCmd setting and set it to default gain. This has been fixed. Known Issues: - Use of the NV memory (to save application data or BLE Host bonding information) during a BLE connection may cause an unexpected disconnect. The likelihood of this happening increases with frequent usage, especially when using short connection intervals. The cause is related to the NV wear algorithm which at some point may cause an NV page erase which can disrupt system real-time processing. It is therefore recommended that the NV memory be used sparingly, or only when a connection is not active. - HCI packet size of 128 bytes or more will be disregarded by the stack, and as such, no HCI event will be returned. - The HAL SPI driver that was implemented since the v1.3 release can sometimes hang, particularly in cases in which power management is used and when there is heavy traffic on the SPI bus. For technical support please visit the Texas Instruments Bluetooth low energy E2E Forum: http://e2e.ti.com/support/low_power_rf/f/538.aspx ------------------------------------------------------------------------------- ------------------------------------------------------------------------------- Version 1.3.1 April 18, 2013 Notices: - This version of the Texas Instruments BLE stack and software is a minor update to the v1.3 release. It contains some minor bug fixes, with no major functional changes. It also contains two additional projects for the CC2541 Advanced Remote Control Kit. - Since none of the profile source code was significantly changed since the v1.3 release, no additional re-testing of the profiles and sample application were done for v1.3.1. The only exception is the HID-over-GATT profile, which was fully re-tested for this release. The BLE protocol stack, including both the controller and host, was completely retested for v1.3.1. Major Changes and Enhancements: - The GAP parameter TGAP_LIM_ADV_TIMEOUT now uses units of seconds instead of milliseconds. - The HidAdvRemote Project has been added. This implements a full mouse-like pointing functionality using motion and gesture control. The project runs on the CC2541 BLE Advanced Control included as part of the CC2541DK-REMOTE kit. The application implements the HID-over-GATT (HOGP) profile with a report descriptor supporting the keyboard, mouse, and consumer control classes of HID devices. - The HidAdvRemoteDongle project has been added. This application runs on the CC2540USB dongle, and implements partial functionality of HID-over-GATT (HOGP) host with a fixed report descriptor to match that of the descriptor of the HidAdvRemote Project. This means that the HidAdvRemoteDongle was designed only to work with the HidAdvRemote, and will not be compatible with any other HOGP devices. This project was created to allow users who are using a host device that does not have native Bluetooth Smart Ready support and/or does not have HOGP support to use the BLE Advanced Remote Control with their system. - For GAP central role applications, the bond manager now properly handles cases in which the peripheral device has erased previously stored bonding information - A new HCI extension API has been added to allow peripheral/slave devices to temporarily ignore any nonzero slave latency value, and explicitly wake up at every connection event regardless of whether it has any data to send. The prototype for the API function HCI_EXT_SetSlaveLatencyOverrideCmd can be found in hci.h, including the description of the function. - A new HCI extension API has been added to allow the application layer to get or set a build revision number. Bug Fixes: - In some cases L2CAP Peripheral Connection Parameter Update requests failed due to a zero value in the transmitWindowOffset parameter when the connection was initially established. This has been fixed and updates should now work successfully. - During bonding, connection failures would occasionally occur due to the OSAL Simple NV driver performing a page compaction and halting the CPU for longer than the time required for the link layer to maintain proper connection timing. To prevent this from occurring, the simple NV driver now has any API to force a page compaction if the page is full beyond a specified threshold. The bond manager calls this API every time a connection is terminated to ensure that compaction occurs before the next connection is set up. - Occasional slave connection failures would previously occur in cases in which the master device sends Update Channel Map requests while a large slave latency value is in use. This has been fixed. - The SensorTag application now properly supports storage of GATT Client Characteristic Configuration Descriptor values with bonded devices. - After disabling advertising, the CC254x would unnecessarily wake up for a short period of time 500ms later. This unecessary wake-up has been removed. - Upon Power-On Reset or after wake-up from PM3, a 400ms delay has been implemented, during which time the CC254x will not go into PM2 sleep. This allows time for the 32kHz crystal to stabilize. Previously, in rare cases with certain hardware configurations the CC254x could have timing issues due to the crystal not having time to stabilize. - Minor bug fixes to GlucoseSensor and GlucoseCollector projects. Known Issues: - Use of the NV memory (to save application data or BLE Host bonding information) during a BLE connection may cause an unexpected disconnect. The likelihood of this happening increases with frequent usage, especially when using short connection intervals. The cause is related to the NV wear algorithm which at some point may cause an NV page erase which can disrupt system real-time processing. It is therefore recommended that the NV memory be used sparingly, or only when a connection is not active. - HCI packet size of 128 bytes or more will be disregarded by the stack, and as such, no HCI event will be returned. - The HAL SPI driver that was implemented since the v1.3 release can sometimes hang, particularly in cases in which power management is used and when there is heavy traffic on the SPI bus. For technical support please visit the Texas Instruments Bluetooth low energy E2E Forum: http://e2e.ti.com/support/low_power_rf/f/538.aspx ------------------------------------------------------------------------------- ------------------------------------------------------------------------------- Version 1.3 Dec 12, 2012 Notices: - This version of the Texas Instruments BLE stack and software features several changes, enhancements, and bug fixes from v1.2.1. Details of these can be found below. Changes and Enhancements: - A new sample project, SensorTag, has been added. This application runs on the CC2541 Sensor Tag board, which is included as part of the CC2541DK-SENSOR development kit. The application includes custom services for an accelerometer, barometer, gyro, humidity sensor, IR temperature sensor, and magnetometer. - A new Boot Image Manager (BIM) is included. This allows one CC2540 or CC2541 device to contain two separate software images (an "A" image and a "B" image) stored in flash. Upon power-up, the BIM selects which image to boot into. This can be based on criteria such as the state of a GPIO pin, or based on a selection from the previously running application upon reset. - A new Over-the-air firmware download (OAD) feature is included. The feature allows a peer device (which could be a central BT Smart device such as a smartphone) to push a new firmware image onto a peripheral device and update the firmware. This feature uses the BIM, in which case the downloaded image gets stored in the opposite flash location as the currently running image. For example, if the "A" image is the current image and is used to perform the download, then the downloaded image becomes the "B" image. Upon reset, the "B" image with the updated firmware would be loaded. The OAD feature optionally allows for the firmware image to be signed (using AES). Both the SensorTag and SimpleBLEPeripheral projects include configurations for using the OAD feature. A central "OADManager" application is also included, demonstrating a central implementation for sending a new firmware image to an OAD target device. - The physical HCI interface used by the network processor (HostTestRelease) has been enhanced to work while power management is enabled on the CC254x device. The UART interface, when using RTS and CTS lines, can be used by an external application processor to wake-up the CC254x network processor. When the network processor has completed all processing, it will go into deep sleep. In addition to UART, an SPI interface has been added as an option for the physical HCI interface. It also supports power management by means of the MRDY and SRDY lines. - The CC2541 configuration of the KeyFobDemo project has been modified to support the new CC2541 keyfob hardware, contained in the CC2541DK-MINI kit. The accelerometer has been changed, and a TPS62730 DC/DC converter has been added. - The structure of all projects have been changed to include a Transport Layer ("TL") library and network processor interface "NPI" source code. This new architecture allows for non-network processor applications to have slightly reduced code size by removing unnecessary stack components. - An API has been provided allowing the device name and appearance characteristics in the GAP service to be modified by the application layer. - KeyFobDemo project now includes visual feedback from LED to indicate when device has powered up and when device is advertising. - The HID-over-GATT Profile (HOGP) implementation has been updated to now queue up HID report and send notifications upon reconnection to a HID host. - A new implementation of the HID service has been included, which supports a combined keyboard, mouse, and consumer class device in its HID report descriptor. - The API for sending L2CAP Connection Parameter Update Requests from the GAP Peripheral Role Profile has been updated to take both the requested minimum and maximum connection intervals as parameters. - BTool has been enhanced with a new GATT explorer table, displaying discovered attributes, handles, and values. An XML file is included which allows the user to define descriptions of characteristics based on their UUIDs. - HCI UART interface baud rate has been changed from 57600 to 115200. Bug Fixes: - When power management is used with long connection intervals (>2s), the CC254x remains sleeping properly without unnecessary wake-ups. - When slave latency is used, peripheral devices now properly wake-up before the next connection event when a data packet is queued - Various bug fixes on the GlucoseSensor and GlucoseCollector projects to improve compliance with profile and service specifications. - HID-over-GATT Pofile (HOGP) implementation has been updated to provide better interoperability with HID hosts. Known Issues: - Use of the NV memory (to save application data or BLE Host bonding information) during a BLE connection may cause an unexpected disconnect. The likelihood of this happening increases with frequent usage, especially when using short connection intervals. The cause is related to the NV wear algorithm which at some point may cause an NV page erase which can disrupt system real-time processing. It is therefore recommended that the NV memory be used sparingly, or only when a connection is not active. - HCI packet size of 128 bytes or more will be disregarded by the stack, and as such, no HCI event will be returned. For technical support please visit the Texas Instruments Bluetooth low energy E2E Forum: http://e2e.ti.com/support/low_power_rf/f/538.aspx ------------------------------------------------------------------------------- ------------------------------------------------------------------------------- Version 1.2.1 Apr 13, 2012 Notices: - This version of the Texas Instruments BLE stack and software is a minor update to the v1.2 release. It contains some minor enhancements and bug fixes, with no API changes or major functional changes. Changes and Enhancements: - When advertising is enabled by calling GAP_MakeDiscoverable, the first advertisement event will now occur within a few milliseconds, rather than waiting for 10ms. Bug Fixes: - The HidEmuKbd project now properly implements the HID Service include of the Battery Service. This bug fix allows for proper interoperability between the CC254x HID Profile and host systems running Windows 8. - The source code file hal_board_cfg.h has been updated to better support the serial bootloader (SBL) and Universal Bootloader (UBL). - Scanning in BTool can now be cancelled at any time without hanging or freezing the system. Known Issues: - Use of the NV memory (to save application data or BLE Host bonding information) during a BLE connection may cause an unexpected disconnect. The likelihood of this happening increases with frequent usage, especially when using short connection intervals. The cause is related to the NV wear algorithm which at some point may cause an NV page erase which can disrupt system real-time processing. It is therefore recommended that the NV memory be used sparingly, or only when a connection is not active. For technica ... ...

近期下载者：

相关文件：

评论：[我要评论] [举报此文件]

收藏者：