PACKAGE
所属分类:单片机开发
开发工具:C/C++
文件大小:146KB
下载次数:44
上传日期:2009-09-29 10:34:44
上 传 者:
newstarnul
说明: CDIP-----Ceramic Dual In-Line Package
CLCC-----Ceramic Leaded Chip Carrier
CQFP-----Ceramic Quad Flat Pack
DIP-----Dual In-Line Package
LQFP-----Low-Profile Quad Flat Pack
MAPBGA------Mold Array Process Ball Grid Array
PBGA-----Plastic Ball Grid Array
PLCC-----Plastic Leaded Chip Carrier
PQFP-----Plastic Quad Flat Pack
QFP-----Quad Flat Pack
SDIP-----Shrink Dual In-Line Package
SOIC-----Small Outline Integrated Package
SSOP-----Shrink Small Outline Package
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芯片封装PACKAGE[1].pdf (181413, 2009-07-30)
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