说明：  温度采集装置主要由温度采集模块、主控模块、上传通信模块、显示模块等部分组成。主控制模块主要由高性能、超低功耗的STC12C5A32S2单片机完成，具有较高的性价比和很强的处理能力。温度采集模块采用1-Wire总线结构及DS18B20温度传感器，DS18B20节约MCU的I/O资源，检测点可扩充性很强。并且DS18B20内部集成了A/D，可向MCU提供A/D转换后的数据（数字信号），从而大大提高了传感器传输的距离和抗干扰能力。
(Temperature acquisition device is mainly composed of temperature acquisition module, main control module, upload communication module, display module and other parts. The main control module is mainly completed by stc12c5a32s2 single chip microcomputer with high performance and ultra-low power consumption, which has high cost performance and strong processing capacity. The temperature acquisition module adopts 1-wire bus structure and DS18B20 temperature sensor. DS18B20 saves the I / O resources of MCU, and the detection point has strong expansibility. And DS18B20 is integrated with a / D, which can provide MCU with data (digital signal) after a / D conversion, thus greatly improving the transmission distance and anti-interference ability of the sensor.)