LED_PCB_Thermal_ByLEDMaker.zip

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design of power LED thermal heatsink by LED maker
LED_PCB_Thermal_ByLEDMaker.zip
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内容介绍
<html xmlns="http://www.w3.org/1999/xhtml"> <head> <meta charset="utf-8"> <meta name="generator" content="pdf2htmlEX"> <meta http-equiv="X-UA-Compatible" content="IE=edge,chrome=1"> <link rel="stylesheet" href="https://static.pudn.com/base/css/base.min.css"> <link rel="stylesheet" href="https://static.pudn.com/base/css/fancy.min.css"> <link rel="stylesheet" href="https://static.pudn.com/prod/directory_preview_static/62508c266caf596192091e1f/raw.css"> <script src="https://static.pudn.com/base/js/compatibility.min.js"></script> <script src="https://static.pudn.com/base/js/pdf2htmlEX.min.js"></script> <script> try{ pdf2htmlEX.defaultViewer = new pdf2htmlEX.Viewer({}); }catch(e){} </script> <title></title> </head> <body> <div id="sidebar" style="display: none"> <div id="outline"> </div> </div> <div id="pf1" class="pf w0 h0" data-page-no="1"><div class="pc pc1 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://static.pudn.com/prod/directory_preview_static/62508c266caf596192091e1f/bg1.jpg"><div class="t m0 x1 h2 y1 ff1 fs0 fc0 sc0 ls0 ws0">Product design<span class="_ _0"></span> guide</div><div class="t m0 x2 h3 y2 ff2 fs1 fc0 sc0 ls1 ws1">Copyright &#169; 2010-2016 Cree, Inc. All rights reserved. <span class="_ _0"></span>The information in this document is subject to change without notice. Cree</div><div class="t m0 x3 h4 y3 ff2 fs2 fc0 sc0 ls1 ws2">&#174;</div><div class="t m0 x4 h3 y2 ff2 fs1 fc0 sc0 ls1 ws1"> and XLamp</div><div class="t m0 x5 h4 y3 ff2 fs2 fc0 sc0 ls1 ws2">&#174;</div><div class="t m0 x6 h3 y2 ff2 fs1 fc0 sc0 ls1 ws1"> are </div><div class="t m0 x2 h3 y4 ff2 fs1 fc0 sc0 ls1 ws3">registered trademarks and <span class="_ _0"></span>the Cree logo is a trademark of Cree, Inc. <span class="_ _0"></span>This document is provided for informational purposes only and is not a warr<span class="_ _0"></span>anty </div><div class="t m0 x2 h3 y5 ff3 fs1 fc0 sc0 ls1 ws2">or <span class="_ _1"></span>a <span class="_ _1"></span>speci&#59300;cation. <span class="_ _1"></span>For <span class="_ _1"></span>product speci&#59300;cations, <span class="_ _1"></span>please <span class="_ _1"></span>see <span class="_ _1"></span>the <span class="_ _1"></span>data <span class="_ _1"></span>sheets <span class="_ _1"></span>available <span class="_ _1"></span>at <span class="_ _1"></span>www<span class="_ _0"></span>.cree.com. <span class="_ _1"></span>For warranty <span class="_ _1"></span>information, <span class="_ _1"></span>please <span class="_ _1"></span>contact <span class="_ _1"></span>Cree </div><div class="t m0 x2 h3 y6 ff2 fs1 fc0 sc0 ls1 ws2">Sales at sales@cree.com. </div><div class="t m0 x7 h3 y2 ff2 fs1 fc0 sc0 ls1 ws2">Cree, Inc.</div><div class="t m0 x8 h3 y4 ff2 fs1 fc0 sc0 ls1 ws2">4600 Silicon Drive</div><div class="t m0 x9 h3 y5 ff2 fs1 fc0 sc0 ls1 ws2">Durham, NC 27703</div><div class="t m0 xa h3 y6 ff2 fs1 fc0 sc0 ls1 ws4">USA T<span class="_ _0"></span>el: +1.919.313.5300</div><div class="t m1 xb h5 y7 ff2 fs0 fc1 sc0 ls2 ws5">WWW<span class="_ _2"></span>.CREE<span class="_ _0"></span>.COM<span class="_ _0"></span>/XLAMP</div><div class="t m2 xc h5 y8 ff4 fs0 fc1 sc0 ls3 ws6">CL<span class="_ _1"></span>D-AP37<span class="_ _0"></span> R<span class="_ _1"></span>EV 2I</div><div class="t m0 xd h6 y9 ff5 fs3 fc1 sc0 ls1 ws2">Optimizing PCB <span class="_ _2"></span>Thermal Performance for Cree</div><div class="t m0 xe h7 ya ff5 fs4 fc1 sc0 ls1 ws2">&#174;</div><div class="t m0 x5 h6 y9 ff5 fs3 fc1 sc0 ls1 ws2"> XLamp</div><div class="t m0 xf h7 ya ff5 fs4 fc1 sc0 ls1 ws2">&#174;</div><div class="t m0 x10 h6 y9 ff5 fs3 fc1 sc0 ls1 ws2"> LEDs</div><div class="t m0 x11 h8 yb ff5 fs5 fc2 sc0 ls4 ws7">INTRODUC<span class="_ _0"></span>TION</div><div class="t m0 x11 h5 yc ff4 fs0 fc3 sc0 ls1 ws8">This Cree application note outlines a </div><div class="t m0 x11 h5 yd ff4 fs0 fc3 sc0 ls1 ws9">technique to assist with the dev<span class="_ _0"></span>elopment </div><div class="t m0 x11 h5 ye ff4 fs0 fc3 sc0 ls1 wsa">of cost-effective thermal management </div><div class="t m0 x11 h5 yf ff4 fs0 fc3 sc0 ls1 wsb">for the XT<span class="_ _3"></span>, XP<span class="_ _4"></span>, XB, MX and ML families of </div><div class="t m0 x11 h5 y10 ff4 fs0 fc3 sc0 ls1 ws2">XLamp</div><div class="t m0 x12 h9 y11 ff4 fs6 fc3 sc0 ls1 ws2">&#174;</div><div class="t m0 x13 h5 y12 ff4 fs0 fc3 sc0 ls1 ws2"> LEDs.</div><div class="t m0 x11 h5 y13 ff4 fs0 fc3 sc0 ls1 wsc">One of the most critical design </div><div class="t m0 x11 h5 y14 ff4 fs0 fc3 sc0 ls1 wsd">parameters for an LED illumination </div><div class="t m0 x11 h5 y15 ff4 fs0 fc3 sc0 ls1 wse">system is the system<span class="_ _0"></span>&#8217;<span class="_ _2"></span>s ability to draw </div><div class="t m0 x11 h5 y16 ff4 fs0 fc3 sc0 ls1 wsf">heat away from the LED junction. </div><div class="t m0 x11 h5 y17 ff4 fs0 fc3 sc0 ls1 ws10">High operating temper<span class="_ _0"></span>atures at the </div><div class="t m0 x11 h5 y18 ff4 fs0 fc3 sc0 ls1 ws11">LED junction adversely affect the </div><div class="t m0 x11 h5 y19 ff4 fs0 fc3 sc0 ls1 ws12">performance of LEDs, resulting in </div><div class="t m0 x11 h5 y1a ff4 fs0 fc3 sc0 ls1 ws13">decreased light output and lifetime.</div><div class="t m0 x14 h9 y1b ff4 fs6 fc3 sc0 ls1 ws2">1</div><div class="t m0 x15 h5 y1c ff4 fs0 fc3 sc0 ls1 ws2"> </div><div class="t m0 x11 h5 y1d ff6 fs0 fc3 sc0 ls1 ws2">T<span class="_ _0"></span>o <span class="_"> </span>pr<span class="_ _0"></span>operly <span class="_"> </span>manage <span class="_"> </span>this <span class="_"> </span>heat, <span class="_ _5"> </span>speci&#59300;c </div><div class="t m0 x11 h5 y1e ff4 fs0 fc3 sc0 ls1 ws14">practices should be followed in the </div><div class="t m0 x11 h5 y1f ff4 fs0 fc3 sc0 ls1 ws15">design, assembly and operation of LEDs </div><div class="t m0 x11 h5 y20 ff4 fs0 fc3 sc0 ls1 ws2">in lighting applications.</div><div class="t m0 x11 h5 y21 ff4 fs0 fc3 sc0 ls1 ws16">This application note outlines a technique </div><div class="t m0 x11 h5 y22 ff4 fs0 fc3 sc0 ls1 ws17">for designing a low-cost printed circuit </div><div class="t m0 x11 h5 y23 ff4 fs0 fc3 sc0 ls1 ws18">board (PCB) layout <span class="_ _0"></span>that optimizes the </div><div class="t m0 x11 h5 y24 ff4 fs0 fc3 sc0 ls1 ws19">transf<span class="_ _0"></span>er of heat from the LED<span class="_ _2"></span>. The </div><div class="t m0 x11 h5 y25 ff4 fs0 fc3 sc0 ls1 ws1a">technique involves the use of FR-4-based </div><div class="t m0 x11 h5 y26 ff4 fs0 fc3 sc0 ls1 ws1b">PCBs, which cost less than metal core </div><div class="t m0 x11 h5 y27 ff4 fs0 fc3 sc0 ls1 ws1c">printed circuit boards (MCPCB), but ha<span class="_ _0"></span>ve </div><div class="t m0 x11 h5 y28 ff4 fs0 fc3 sc0 ls1 ws1d">greater thermal resistance. <span class="_ _0"></span>The use of </div><div class="t m0 x11 h5 y29 ff4 fs0 fc3 sc0 ls1 ws1e">metal-lined holes or vias underneath LED </div><div class="t m0 x11 h5 y2a ff4 fs0 fc3 sc0 ls1 ws1f">thermal pads is a method to dissipate </div><div class="t m0 x11 h5 y2b ff4 fs0 fc3 sc0 ls1 ws20">heat through an FR-4 PCB and int<span class="_ _0"></span>o an </div><div class="t m0 x11 h5 y2c ff4 fs0 fc3 sc0 ls1 ws2">appropriate heat sink.</div><div class="t m0 x11 h5 y2d ff4 fs0 fc3 sc0 ls1 ws21">Cree XLamp LEDs are designed with </div><div class="t m0 x11 h5 y2e ff4 fs0 fc3 sc0 ls1 ws22">an electrically isolated thermal path. </div><div class="t m0 x11 h5 y2f ff4 fs0 fc3 sc0 ls1 ws23">Cree pioneered this LED f<span class="_ _0"></span>eature almost </div><div class="t m0 x11 h5 y30 ff4 fs0 fc3 sc0 ls1 ws24">ten years ago to enable the use of </div><div class="t m0 x11 ha y31 ff4 fs7 fc3 sc0 ls1 ws25">1 <span class="_ _6"> </span>See the <span class="fc2">Long-T<span class="_ _0"></span>erm Lumen Maintenance </span></div><div class="t m0 x16 ha y32 ff4 fs7 fc2 sc0 ls1 ws2">application note<span class="fc3">.</span></div><div class="t m0 x17 h5 y33 ff4 fs0 fc3 sc0 ls1 ws26">metalized vias in FR-4 PCBs. For certain </div><div class="t m0 x17 h5 y34 ff4 fs0 fc3 sc0 ls1 ws27">illumination systems design, thermal </div><div class="t m0 x17 h5 y35 ff4 fs0 fc3 sc0 ls1 ws28">vias enable the use of FR-4 circuit boards </div><div class="t m0 x17 h5 y36 ff4 fs0 fc3 sc0 ls1 ws29">instead of metal core circuit boar<span class="_ _0"></span>ds. This </div><div class="t m0 x17 h5 y37 ff4 fs0 fc3 sc0 ls1 ws2a">can deliver system cost savings in cir<span class="_ _0"></span>cuit </div><div class="t m0 x17 h5 y38 ff4 fs0 fc3 sc0 ls1 ws2">board and heat sink selection.</div><div class="t m0 x17 h5 y39 ff4 fs0 fc3 sc0 ls1 ws2b">This application note serves as a </div><div class="t m0 x17 h5 y3a ff4 fs0 fc3 sc0 ls1 ws2c">practical guideline based on heat </div><div class="t m0 x17 h5 y3b ff4 fs0 fc3 sc0 ls1 ws2d">transf<span class="_ _0"></span>er fundamentals and includes </div><div class="t m0 x17 h5 y3c ff6 fs0 fc3 sc0 ls1 ws2">suggestive, <span class="_ _1"></span>but <span class="_ _7"></span>not <span class="_ _1"></span>de&#59300;nitive, <span class="_ _7"></span>simulation </div><div class="t m0 x17 h5 y3d ff4 fs0 fc3 sc0 ls1 ws2e">and measurement data. Cree advocates </div><div class="t m0 x17 h5 y3e ff4 fs0 fc3 sc0 ls1 ws2f">this technique as appropriate design </div><div class="t m0 x17 h5 y3f ff4 fs0 fc3 sc0 ls1 ws30">for certain lighting applications and </div><div class="t m0 x17 h5 y40 ff4 fs0 fc3 sc0 ls1 ws31">encourages Cr<span class="_ _0"></span>ee<span class="_ _0"></span>&#8217;<span class="_ _2"></span>s customers to evaluate </div><div class="t m0 x17 h5 y41 ff4 fs0 fc3 sc0 ls1 ws32">this option when considering the many </div><div class="t m0 x17 h5 y42 ff4 fs0 fc3 sc0 ls1 ws33">thermal management techniques </div><div class="t m0 x17 h5 y43 ff4 fs0 fc3 sc0 ls1 ws34">available. For additional <span class="_ _0"></span>guidelines on </div><div class="t m0 x17 h5 y44 ff4 fs0 fc3 sc0 ls1 ws35">LED thermal management, refer t<span class="_ _0"></span>o the </div><div class="t m0 x17 h5 y45 ff4 fs0 fc2 sc0 ls1 ws2">Thermal Management application note<span class="fc3">.</span></div><div class="t m0 xd h8 yb ff5 fs5 fc2 sc0 ls4 ws36">T<span class="_ _2"></span>ABLE OF<span class="_ _0"></span> CONTENT<span class="_ _0"></span>S</div><div class="t m0 xd h5 yc ff4 fs0 fc3 sc0 ls1 ws2">Introduction<span class="ws37"> ..............................................</span>1</div><div class="t m0 xd h5 yd ff4 fs0 fc3 sc0 ls1 ws2">Thermal Management Principles<span class="ws38"> ............</span>2</div><div class="t m0 x18 h5 ye ff4 fs0 fc3 sc0 ls1 ws39">XLamp LED Thermal </div><div class="t m0 x18 h5 yf ff4 fs0 fc3 sc0 ls1 ws2">Characteristics<span class="ws39"> ...................................</span>2</div><div class="t m0 x18 h5 y10 ff4 fs0 fc3 sc0 ls1 ws39">PCB Thermal Characteristics<span class="ws2a"> ............<span class="ws2">3</span></span></div><div class="t m0 x18 h5 y46 ff4 fs0 fc3 sc0 ls1 ws39">Designing Thermal Vias<span class="ws3a"> .....................<span class="_ _1"></span><span class="ws2">4</span></span></div><div class="t m0 x18 h5 y47 ff4 fs0 fc3 sc0 ls1 ws2">Open Vias vs. Filled Vias<span class="ws38"> ....................</span>5</div><div class="t m0 xd h5 y48 ff4 fs0 fc3 sc0 ls1 ws2">Thermal Performance Simulations<span class="ws3b"> .........<span class="_"> </span></span>7</div><div class="t m0 x18 h5 y49 ff4 fs0 fc3 sc0 ls1 ws39">Surface Thermal Dissipation<span class="ws3c"> .............<span class="_ _1"></span><span class="ws2">7</span></span></div><div class="t m0 x18 h5 y4a ff4 fs0 fc3 sc0 ls1 ws2">Thermal Dissipation with Vias<span class="ws3d"> ...........</span>8</div><div class="t m0 x18 h5 y4b ff4 fs0 fc3 sc0 ls1 ws2">Combined Surface and Via Studies 10</div><div class="t m0 x18 h5 y4c ff4 fs0 fc3 sc0 ls1 ws2">Summary Results of Thermal </div><div class="t m0 x18 h5 y4d ff4 fs0 fc3 sc0 ls1 ws2">Simulations<span class="ws3e"> .......................................</span>12</div><div class="t m0 xd h5 y4e ff6 fs0 fc3 sc0 ls1 ws2">T<span class="_ _0"></span>emper<span class="_ _0"></span>ature V<span class="_ _0"></span>eri&#59300;cation </div><div class="t m0 xd h5 y4f ff4 fs0 fc3 sc0 ls1 ws2">Measurements<span class="ws3f"> .......................................</span>13</div><div class="t m0 xd h5 y50 ff4 fs0 fc3 sc0 ls1 ws2">Recommended Board Layouts<span class="ws40"> ..............<span class="_ _0"></span><span class="ws2">15</span></span></div><div class="t m0 x18 h5 y51 ff6 fs0 fc3 sc0 ls1 ws2">Gerber &#59300;les<span class="ff4 ws41"> ........................................<span class="ws2">15</span></span></div><div class="t m0 x18 h5 y52 ff4 fs0 fc3 sc0 ls1 ws2">FR-4 Boards for XLamp XP and XT<span class="_ _0"></span> </div><div class="t m0 x18 h5 y53 ff4 fs0 fc3 sc0 ls1 ws2">LED Packages<span class="ws42"> ...................................</span>16</div><div class="t m0 x18 h5 y54 ff4 fs0 fc3 sc0 ls1 ws2">FR-4 Boards for XLamp XB LED </div><div class="t m0 x18 h5 y55 ff4 fs0 fc3 sc0 ls1 ws2">Package<span class="ws43"> ............................................</span>17</div><div class="t m0 x18 h5 y56 ff4 fs0 fc3 sc0 ls1 ws2">FR-4 Boards for XLamp MX LED </div><div class="t m0 x18 h5 y57 ff4 fs0 fc3 sc0 ls1 ws2">Package<span class="ws43"> ............................................</span>19</div><div class="t m0 x18 h5 y58 ff4 fs0 fc3 sc0 ls1 ws2">FR-4 Boards for XLamp ML LED </div><div class="t m0 x18 h5 y59 ff4 fs0 fc3 sc0 ls1 ws2">Package<span class="ws43"> ............................................</span>20</div><div class="t m0 xd h5 y5a ff4 fs0 fc3 sc0 ls1 ws2">Chemical Compatibility..........................21</div><div class="t m0 xd h5 y5b ff4 fs0 fc3 sc0 ls1 ws2">References<span class="ws44"> 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