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<div id="pf1" class="pf w0 h0" data-page-no="1"><div class="pc pc1 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://static.pudn.com/prod/directory_preview_static/6243f6f80cf57275afc21e34/bg1.jpg"><div class="t m0 x1 h2 y1 ff1 fs0 fc0 sc0 ls0 ws0">[术语]IC 封装 </div><div class="t m0 x2 h3 y2 ff2 fs1 fc0 sc1 ls1 ws0">1<span class="ff1">、</span><span class="ls2 ws1">BGA(ball grid array) <span class="_ _0"> </span> </span></div><div class="t m0 x2 h3 y3 ff1 fs1 fc0 sc1 ls1 ws0">球形触点陈列，表面贴装型封装之一。在印刷基板的背面按陈列方式制作出球形凸点用以<span class="ff2 ls3"> </span></div><div class="t m0 x2 h3 y4 ff1 fs1 fc0 sc1 ls1 ws0">代替引脚，<span class="_ _1"></span>在印刷基板的正面装配<span class="ff2 ls4">LSI </span>芯片，<span class="_ _1"></span>然后用模压树脂或灌封方法进行密封。<span class="_ _1"></span>也称为</div><div class="t m0 x2 h3 y5 ff1 fs1 fc0 sc1 ls1 ws0">凸点陈列载体<span class="ff2 ls5">(PAC)</span>。引脚可超过<span class="_ _2"> </span><span class="ff2 ls6">200</span>，是多引脚<span class="ff2 ls4">LSI </span>用的一种封装。封装本体也可做得比</div><div class="t m0 x2 h3 y6 ff2 fs1 fc0 sc1 ls7 ws0">QFP(<span class="ff1 ls1">四侧引脚扁平封装<span class="ff2">)</span>小。例如，引脚中心距为<span class="_ _2"> </span></span><span class="ls8">1.5mm <span class="ff1 ls1">的<span class="_ _2"> </span></span><span class="ls6">360 <span class="ff1 ls1">引脚</span><span class="ls4">BGA <span class="ff1 ls1">仅为<span class="_ _2"> </span><span class="ff2">31mm </span>见</span></span></span></span></div><div class="t m0 x2 h3 y7 ff1 fs1 fc0 sc1 ls1 ws0">方；而引脚中心距为<span class="_ _2"> </span><span class="ff2 ls8">0.5mm </span>的<span class="_ _2"> </span><span class="ff2 ls6">304 </span>引脚<span class="ff2 ls7">QFP </span>为<span class="_ _2"> </span><span class="ff2">40mm </span>见方。而且<span class="ff2 ls4">BGA </span>不用担心<span class="ff2 ls7">QFP </span>那</div><div class="t m0 x2 h3 y8 ff1 fs1 fc0 sc1 ls1 ws0">样的引脚变形问题。该封装是美国<span class="ff2 ls9">Motorola </span>公司开发的，首先在便携式电话等设备中被采</div><div class="t m0 x2 h3 y9 ff1 fs1 fc0 sc1 ls1 ws0">用，今后在美国有可能在个人计算机中普及。最初，<span class="ff2 ls4">BGA </span>的引脚<span class="ff2">(</span>凸点<span class="ff2">)</span>中心距为<span class="_ _2"> </span><span class="ff2 lsa">1.5mm</span>，</div><div class="t m0 x2 h3 ya ff1 fs1 fc0 sc1 ls1 ws0">引脚数为<span class="_ _2"> </span><span class="ff2 ls6">225</span>。现在也有一些<span class="ff2 ls4">LSI </span>厂家正在开发<span class="_ _2"> </span><span class="ff2 ls6">500 </span>引脚的<span class="ff2 lsb">BGA</span>。<span class="ff2 ls4">BGA </span>的问题是回流焊后</div><div class="t m0 x2 h3 yb ff1 fs1 fc0 sc1 ls1 ws0">的外观检查。现在尚不清楚是否有效的外观检查方法。有的认为，由于焊接的中心距较大，</div><div class="t m0 x2 h3 yc ff1 fs1 fc0 sc1 ls1 ws0">连接可以看作是稳定的，<span class="_ _1"></span>只能通过功能检查来处理。<span class="_ _3"></span><span class="ff2"> <span class="_ _0"> </span><span class="ff1">美国</span><span class="ls9">Motorola </span><span class="ff1">公司把用模压树脂密封</span></span></div><div class="t m0 x2 h3 yd ff1 fs1 fc0 sc1 ls1 ws0">的封装称为<span class="ff2 lsc">OMPAC</span>，而把灌封方法密封的封装称为<span class="ff2 lsd">GPAC(</span>见<span class="ff2 lse">OMPAC </span>和<span class="ff2 lsd">GPAC)</span>。<span class="ff2 ls3"> </span></div><div class="t m0 x2 h4 ye ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m0 x2 h4 yf ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m0 x2 h3 y10 ff2 fs1 fc0 sc1 ls1 ws0">2<span class="ff1">、</span><span class="lsf ws2">BQFP(quad flat package with bumper) <span class="_ _0"> </span> </span></div><div class="t m0 x2 h3 y11 ff1 fs1 fc0 sc1 ls1 ws0">带缓冲垫的四侧引脚扁平封装。<span class="ff2 ls7">QFP </span>封装之一，在封装本体的四个角设置突起<span class="ff2">(</span>缓冲垫<span class="ff2">)</span>以<span class="ff2 ls3"> </span></div><div class="t m0 x2 h3 y12 ff1 fs1 fc0 sc1 ls1 ws0">防止在运送过程中引脚发生弯曲变形。<span class="_ _1"></span>美国半导体厂家主要在微处理器和<span class="ff2 ls10">ASIC </span>等电路中采</div><div class="t m0 x2 h3 y13 ff1 fs1 fc0 sc1 ls1 ws0">用<span class="ff2 ls3"> </span></div><div class="t m0 x2 h3 y14 ff1 fs1 fc0 sc1 ls1 ws0">此封装。引脚中心距<span class="_ _2"> </span><span class="ff2 ls2">0.635mm</span>，引脚数从<span class="_ _2"> </span><span class="ff2 ls6">84 </span>到</div><div class="t m0 x3 h3 y15 ff2 fs1 fc0 sc1 ls6 ws0">196 <span class="ff1 ls1">左右<span class="ff2">(</span>见</span><span class="ls7">QFP)<span class="ff1 ls1">。</span><span class="ls3"> </span></span></div><div class="t m0 x2 h4 y16 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m0 x2 h4 y17 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m0 x2 h3 y18 ff2 fs1 fc0 sc1 ls1 ws0">3<span class="ff1">、碰焊</span><span class="ls9 ws3">PGA(butt joint pin grid array) <span class="_ _0"> </span> </span></div><div class="t m0 x2 h3 y19 ff1 fs1 fc0 sc1 ls1 ws0">表面贴装型<span class="ff2 ls4">PGA </span>的别称<span class="ff2">(</span>见表面贴装型<span class="ff2 ls4">PGA)</span>。<span class="ff2 ls3"> </span></div><div class="t m0 x2 h4 y1a ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m0 x2 h4 y1b ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m0 x2 h3 y1c ff2 fs1 fc0 sc1 ls1 ws0">4<span class="ff1">、</span>C<span class="ff1">－</span><span class="ls5 ws4">(ceramic) </span></div><div class="t m0 x2 h3 y1d ff1 fs1 fc0 sc1 ls1 ws0">表示陶瓷封装的记号。例如，<span class="ff2 ls10">CDIP </span>表示的是陶瓷<span class="ff2">DIP</span>。是在实际中经常使用的记号。<span class="ff2 ls3"> </span></div><div class="t m0 x2 h4 y1e ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m0 x2 h4 y1f ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m0 x2 h3 y20 ff2 fs1 fc0 sc1 ls1 ws0">5<span class="ff1">、</span><span class="ls11 ws5">Cerdip </span></div><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' 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<div id="pf2" class="pf w0 h0" data-page-no="2"><div class="pc pc2 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://static.pudn.com/prod/directory_preview_static/6243f6f80cf57275afc21e34/bg2.jpg"><div class="t m2 x2 h3 y21 ff1 fs1 fc0 sc1 ls1 ws0">用玻璃密封的陶瓷双列直插式封装，<span class="_ _3"></span>用于<span class="ff2 ls12 ws6">ECL RAM</span>，<span class="_ _3"></span><span class="ff2 ls13">DSP(<span class="ff1 ls1">数字信号处理器<span class="ff2">)</span>等电路。<span class="_ _3"></span>带有<span class="ff2 ls14"> </span></span></span></div><div class="t m2 x2 h3 y22 ff1 fs1 fc0 sc1 ls1 ws0">玻璃窗口的<span class="ff2 ls11">Cerdip </span>用于紫外线擦除型<span class="ff2 lse">EPROM </span>以及内部带有<span class="ff2 lse">EPROM </span>的微机电路等。引脚</div><div class="t m2 x2 h3 y23 ff1 fs1 fc0 sc1 ls1 ws0">中心<span class="ff2 ls3"> </span></div><div class="t m2 x2 h3 y24 ff1 fs1 fc0 sc1 ls1 ws0">距<span class="_ _2"> </span><span class="ff2 ls15">2.54mm</span>，引脚数从<span class="_ _2"> </span><span class="ff2 ls6">8 </span>到<span class="_ _2"> </span><span class="ff2 ls6">42</span>。在日本，此封装表示为<span class="ff2">DIP</span>－<span class="ff2 ls16">G(G </span>即玻璃密封的意思<span class="ff2">)</span>。<span class="ff2 ls3"> </span></div><div class="t m2 x2 h4 y25 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h4 y26 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h3 y27 ff2 fs1 fc0 sc1 ls1 ws0">6<span class="ff1">、</span><span class="ls6 ws7">Cerquad </span></div><div class="t m2 x2 h3 y28 ff1 fs1 fc0 sc1 ls1 ws0">表面贴装型封装之一，<span class="_ _3"></span>即用下密封的陶瓷<span class="ff2 lsa">QFP</span>，<span class="_ _3"></span>用于封装<span class="ff2 ls17">DSP </span>等的逻辑<span class="ff2 ls4">LSI </span>电路。<span class="_ _3"></span>带有窗<span class="ff2 ls3"> </span></div><div class="t m2 x2 h3 y29 ff1 fs1 fc0 sc1 ls1 ws0">口的<span class="ff2 ls6">Cerquad </span>用于封装<span class="ff2 lse">EPROM </span>电路。散热性比塑料<span class="ff2 ls7">QFP </span>好，在自然空冷条件下可容许<span class="_ _2"> </span><span class="ff2 ls6">1.</span></div><div class="t m2 x2 h3 y2a ff2 fs1 fc0 sc1 ls1 ws0">5<span class="ff1">～</span><span class="ls3"> </span></div><div class="t m2 x2 h3 y2b ff2 fs1 fc0 sc1 ls11 ws0">2W <span class="ff1 ls1">的功率。但封装成本比塑料</span><span class="ls7">QFP <span class="ff1 ls1">高<span class="_ _2"> </span><span class="ff2">3</span>～</span><span class="ls6">5 <span class="ff1 ls1">倍。引脚中心距有<span class="_ _2"> </span></span><span class="ls15">1.27mm<span class="ff1 ls1">、</span><span class="lsa">0.8mm<span class="ff1 ls1">、</span><span class="ls18">0.65m</span></span></span></span></span></div><div class="t m2 x2 h3 y2c ff2 fs1 fc0 sc1 ls1 ws0">m<span class="ff1">、</span><span class="lsa">0.5mm</span><span class="ff1">、</span><span class="ls3"> </span></div><div class="t m2 x2 h3 y2d ff2 fs1 fc0 sc1 ls8 ws0">0.4mm <span class="ff1 ls1">等多种规格。引脚数从<span class="_ _2"> </span></span><span class="ls6">32 <span class="ff1 ls1">到<span class="_ _2"> </span></span>368<span class="ff1 ls1">。</span><span class="ls3"> </span></span></div><div class="t m2 x2 h4 y2e ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h4 y2f ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h3 y30 ff2 fs1 fc0 sc1 ls1 ws0">7<span class="ff1">、</span><span class="ls9 ws3">CLCC(ceramic leaded chip carrier) <span class="_ _0"> </span> </span></div><div class="t m2 x2 h3 y31 ff1 fs1 fc0 sc1 ls1 ws0">带引脚的陶瓷芯片载体，表面贴装型封装之一，引脚从封装的四个侧面引出，呈丁字形。<span class="ff2 ls3"> </span></div><div class="t m2 x2 h3 y32 ff1 fs1 fc0 sc1 ls1 ws0">带有窗口的用于封装紫外线擦除型<span class="ff2 lse">EPROM </span>以及带有<span class="ff2 lse">EPROM </span>的微机电路等。<span class="_ _4"></span>此封装也称为</div><div class="t m2 x2 h4 y33 ff2 fs1 fc0 sc1 ls3 ws0"> </div><div class="t m2 x2 h3 y34 ff2 fs1 fc0 sc1 lsa ws0">QFJ<span class="ff1 ls1">、</span>QFJ<span class="ff1 ls1">－</span><span class="ls2">G(<span class="ff1 ls1">见</span><span class="ls19">QFJ)</span></span></div><div class="t m2 x4 h3 y35 ff1 fs1 fc0 sc1 ls1 ws0">。<span class="ff2 ls3"> </span></div><div class="t m2 x2 h4 y36 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h4 y37 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h3 y38 ff2 fs1 fc0 sc1 ls1 ws0">8<span class="ff1">、</span><span class="ls1a ws8">COB(chip on board) <span class="_ _0"> </span> </span></div><div class="t m2 x2 h3 y39 ff1 fs1 fc0 sc1 ls1 ws0">板上芯片封装，是裸芯片贴装技术之一，半导体芯片交接贴装在印刷线路板上，芯片与基<span class="ff2 ls3"> </span></div><div class="t m2 x2 h3 y3a ff1 fs1 fc0 sc1 ls1 ws0">板的电气连接用引线缝合方法实现，<span class="_ _5"></span>芯片与基板的电气连接用引线缝合方法实现，<span class="_ _5"></span>并用树脂</div><div class="t m2 x2 h3 y3b ff1 fs1 fc0 sc1 ls1 ws0">覆<span class="ff2 ls3"> </span></div><div class="t m2 x2 h3 y3c ff1 fs1 fc0 sc1 ls1 ws0">盖以确保可靠性。<span class="_ _1"></span>虽然<span class="ff2 lsd">COB </span>是最简单的裸芯片贴装技术，<span class="_ _3"></span>但它的封装密度远不如<span class="ff2 ls19">TAB </span>和倒</div><div class="t m2 x2 h3 y3d ff1 fs1 fc0 sc1 ls1 ws0">片<span class="ff2 ls3"> </span></div><div class="t m2 x2 h3 y3e ff1 fs1 fc0 sc1 ls1 ws0">焊技术。<span class="ff2 ls3"> </span></div><div class="t m2 x2 h4 y3f ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h4 y40 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h3 y41 ff2 fs1 fc0 sc1 ls1 ws0">9<span class="ff1">、</span><span class="ls5 ws9">DFP(dual flat package) <span class="_ _0"> </span> </span></div><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div 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<div id="pf3" class="pf w0 h0" data-page-no="3"><div class="pc pc3 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://static.pudn.com/prod/directory_preview_static/6243f6f80cf57275afc21e34/bg3.jpg"><div class="t m2 x2 h3 y21 ff1 fs1 fc0 sc1 ls1 ws0">双侧引脚扁平封装。是<span class="ff2 ls4">SOP </span>的别称<span class="ff2">(</span>见<span class="ff2 ls4">SOP)</span>。以前曾有此称法，现在已基本上不用。<span class="ff2 ls3"> </span></div><div class="t m2 x2 h4 y42 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h4 y43 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h3 y44 ff2 fs1 fc0 sc1 ls6 ws0">10<span class="ff1 ls1">、</span><span class="ls15 wsa">DIC(dual in-line ceramic package) <span class="_ _0"> </span> </span></div><div class="t m2 x2 h3 y45 ff1 fs1 fc0 sc1 ls1 ws0">陶瓷<span class="ff2 ls7">DIP(</span>含玻璃密封<span class="ff2">)</span>的别称<span class="ff2">(</span>见<span class="ff2 ls13 wsb">DIP). </span></div><div class="t m2 x2 h4 y46 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h4 y47 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h3 y48 ff2 fs1 fc0 sc1 ls6 ws0">11<span class="ff1 ls1">、</span><span class="ls12 ws6">DIL(dual in-line) <span class="_ _0"> </span> </span></div><div class="t m2 x2 h3 y49 ff2 fs1 fc0 sc1 ls7 ws0">DIP <span class="ff1 ls1">的别称<span class="ff2">(</span>见</span>DIP)<span class="ff1 ls1">。欧洲半导体厂家多用此名称。</span><span class="ls3"> </span></div><div class="t m2 x2 h4 y4a ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h4 y4b ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h3 y2c ff2 fs1 fc0 sc1 ls6 ws0">12<span class="ff1 ls1">、</span><span class="ls9 ws3">DIP(dual in-line package) <span class="_ _0"> </span> </span></div><div class="t m2 x2 h3 y2d ff1 fs1 fc0 sc1 ls1 ws0">双列直插式封装。插装型封装之一，引脚从封装两侧引出，封装材料有塑料和陶瓷两种。<span class="ff2 ls3"> </span></div><div class="t m2 x2 h3 y4c ff2 fs1 fc0 sc1 ls7 ws0">DIP <span class="ff1 ls1">是最普及的插装型封装，应用范围包括标准逻辑</span><span class="ls1b">IC<span class="ff1 ls1">，存贮器</span><span class="ls5">LSI<span class="ff1 ls1">，微机电路等。</span><span class="ls3"> </span></span></span></div><div class="t m2 x2 h3 y4d ff1 fs1 fc0 sc1 ls1 ws0">引脚中心距<span class="_ _2"> </span><span class="ff2 ls15">2.54mm</span>，引脚数从<span class="_ _2"> </span><span class="ff2 ls6">6 </span>到<span class="_ _2"> </span><span class="ff2 ls6">64</span>。封装宽度通常为<span class="_ _2"> </span><span class="ff2 ls15">15.2mm</span>。有的把宽度为<span class="_ _2"> </span><span class="ff2 ls18">7.52m</span></div><div class="t m2 x2 h4 y4e ff2 fs1 fc0 sc1 ls1c wsc">m </div><div class="t m2 x2 h3 y31 ff1 fs1 fc0 sc1 ls1 ws0">和<span class="_ _2"> </span><span class="ff2 ls5">10.16mm </span>的封装分别称为<span class="ff2 ls13 wsd">skinny DIP </span>和<span class="ff2 ls1d wse">slim DIP(</span>窄体型<span class="ff2 ls7">DIP)</span>。但多数情况下并不加区</div><div class="t m2 x2 h3 y32 ff1 fs1 fc0 sc1 ls1 ws0">分，<span class="ff2 ls3"> </span></div><div class="t m2 x2 h3 y4f ff1 fs1 fc0 sc1 ls1 ws0">只简单地统称为<span class="ff2">DIP</span>。另外，用低熔点玻璃密封的陶瓷<span class="ff2 ls7">DIP </span>也称为<span class="ff2 ls9">cerdip(</span>见<span class="ff2 ls9">cerdip)</span>。<span class="ff2 ls3"> </span></div><div class="t m2 x2 h4 y50 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h4 y51 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h3 y52 ff2 fs1 fc0 sc1 ls6 ws0">13<span class="ff1 ls1">、</span><span class="ls5 ws9">DSO(dual small out-lint) <span class="_ _0"> </span> </span></div><div class="t m2 x2 h3 y53 ff1 fs1 fc0 sc1 ls1 ws0">双侧引脚小外形封装。<span class="ff2 ls4">SOP </span>的别称<span class="ff2">(</span>见<span class="ff2 ls4">SOP)</span>。部分半导体厂家采用此名称。<span class="ff2 ls3"> </span></div><div class="t m2 x2 h4 y54 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h4 y55 ff2 fs1 fc0 sc1 ls1 ws0"> </div><div class="t m2 x2 h3 y56 ff2 fs1 fc0 sc1 ls6 ws0">14<span class="ff1 ls1">、</span><span class="ls9 ws3">DICP(dual tape carrier package) <span class="_ _0"> </span> </span></div><div class="t m2 x2 h3 y3c ff1 fs1 fc0 sc1 ls1 ws0">双侧引脚带载封装。<span class="_ _3"></span><span class="ff2 ls1e">TCP(<span class="ff1 ls1">带载封装<span class="ff2">)</span></span></span></div><div class="t m2 x5 h3 y57 ff1 fs1 fc0 sc1 ls1 ws0">之一。<span class="_ _3"></span>引脚制作在绝缘带上并从封装两侧引出。<span class="_ _3"></span>由于利</div><div class="t m2 x2 h4 y58 ff2 fs1 fc0 sc1 ls3 ws0"> </div><div class="t m2 x2 h3 y59 ff1 fs1 fc0 sc1 ls1 ws0">用的是<span class="ff2 ls19">TAB(</span>自动带载焊接<span class="ff2">)</span>技术，封装外形非常薄。常用于液晶显示驱动<span class="ff2 ls5">LSI</span>，但多数为定</div><div class="t m2 x2 h3 y5a ff1 fs1 fc0 sc1 ls1 ws0">制品。<span class="ff2 ls3"> </span></div><div class="t m2 x2 h3 y5b ff1 fs1 fc0 sc1 ls1 ws0">另外，<span class="ff2 ls8">0.5mm </span>厚的存储器<span class="ff2 ls4">LSI </span>簿形封装正处于开发阶段。在日本，按照<span class="ff2 ls1f">EIAJ(</span>日本电子机械</div><div class="t m2 x2 h3 y5c ff1 fs1 fc0 sc1 ls1 ws0">工<span class="ff2 ls3"> </span></div><a class="l" rel='nofollow' onclick='return false;'><div class="d m1"></div></a><a class="l" rel='nofollow' onclick='return false;'><div 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