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<div id="pf1" class="pf w0 h0" data-page-no="1"><div class="pc pc1 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://static.pudn.com/prod/directory_preview_static/62862884b305d84a4f6d45cd/bg1.jpg"><div class="c x0 y1 w2 h0"><div class="t m0 x1 h2 y2 ff1 fs0 fc0 sc0 ls0 ws0">半导体材料研究框架系列：</div><div class="t m0 x2 h3 y3 ff1 fs1 fc0 sc0 ls1 ws0">详解八大芯片材料</div><div class="t m0 x3 h4 y4 ff2 fs2 fc0 sc0 ls0 ws0">——<span class="ls2">行业深度报告</span></div><div class="t m0 x4 h5 y5 ff2 fs3 fc1 sc0 ls0 ws0">证券研究报告</div><div class="t m0 x4 h6 y6 ff2 fs4 fc1 sc0 ls2 ws0">电子行业</div><div class="t m0 x4 h6 y7 ff3 fs4 fc1 sc0 ls3 ws0">2022<span class="ff2 ls0">年<span class="ff3">1</span>月</span>19<span class="ff2 ls0">日</span></div><div class="t m0 x5 h5 y8 ff2 fs3 fc0 sc0 ls1 ws0">分析师：<span class="_ _0"> </span>陈杭<span class="_ _1"> </span>登记编号：<span class="_ _2"> </span><span class="ff3 ls0">S1220519110008</span></div><div class="t m0 x5 h6 y9 ff2 fs4 fc0 sc0 ls0 ws0">联系人：<span class="_ _0"> </span>李萌</div></div></div><div class="pi" data-data='{"ctm":[1.333333,0.000000,0.000000,1.333333,0.000000,0.000000]}'></div></div>
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<div id="pf2" class="pf w0 h0" data-page-no="2"><div class="pc pc2 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://static.pudn.com/prod/directory_preview_static/62862884b305d84a4f6d45cd/bg2.jpg"><div class="c x0 y1 w2 h0"><div class="t m0 x6 h7 ya ff2 fs5 fc0 sc0 ls0 ws0">资料来源：方正证券研究所</div><div class="t m0 x7 h8 yb ff1 fs4 fc2 sc0 ls0 ws0">投资要点</div><div class="t m0 x4 h7 yc ff4 fs5 fc2 sc0 ls0 ws0">⚫<span class="_ _3"> </span><span class="ff2">在整个电子信息产业中，半导体<span class="_ _4"></span>材料行业因其<span class="_ _4"></span>具有极大的附<span class="_ _4"></span>加值和特有的<span class="_ _4"></span>产业生态支撑<span class="_ _4"></span>作用而往往成<span class="_ _4"></span>为国</span></div><div class="t m0 x8 h7 yd ff2 fs5 fc2 sc0 ls0 ws0">家之间博弈的筹码。<span class="_ _5"> </span><span class="ff1">我们归纳出半导体材料行业具备以<span class="_ _4"></span>下特征：<span class="ff2">（<span class="ff3">1</span>）细分<span class="_ _4"></span>品类众多，每<span class="_ _4"></span>一大类材料通<span class="_ _4"></span>常</span></span></div><div class="t m0 x8 h7 ye ff2 fs5 fc2 sc0 ls0 ws0">包括若干具体产品，单一市场较<span class="_ _4"></span>小，<span class="ff1">平台化布局至关<span class="_ _4"></span>重要<span class="ff2 ls4">；（</span><span class="ff3">2<span class="ff2">）子行业间技术跨度大<span class="_ _4"></span>，半导体材料<span class="_ _4"></span>各细分</span></span></span></div><div class="t m0 x8 h7 yf ff2 fs5 fc2 sc0 ls0 ws0">领域龙头各不相同；（<span class="ff3">3</span>）<span class="ff1">下游认证壁<span class="_ _4"></span>垒高<span class="ff2">，客户粘<span class="_ _4"></span>性大<span class="_ _5"> </span>（<span class="ff3">4</span>）<span class="ff1">同下游晶圆制造之间高度正相关，<span class="_ _4"></span>发展依赖</span></span></span></div><div class="t m0 x8 h7 y10 ff1 fs5 fc2 sc0 ls0 ws0">晶圆厂产能放量<span class="_ _5"> </span><span class="ff2">；（<span class="ff3">5</span>）不同于半导体设备，</span>半导体材料作为<span class="_ _4"></span>耗材，每年都<span class="_ _4"></span>有需求，整体<span class="_ _4"></span>市场规模稳步<span class="_ _4"></span>向</div><div class="t m0 x8 h9 y11 ff1 fs6 fc2 sc0 ls0 ws0">上<span class="ff2 ls1">；（</span><span class="ff3">6<span class="ff2">）</span></span>政策驱动性行业<span class="_ _4"></span><span class="ff2">，往往依靠<span class="_ _4"></span>专项政<span class="_ _4"></span>策推动技术<span class="_ _4"></span>成果转化<span class="_ _4"></span>。</span></div><div class="t m0 x4 h7 y12 ff4 fs5 fc2 sc0 ls0 ws0">⚫<span class="_ _3"> </span><span class="ff2">中国半导体材料行业<span class="ff3">3</span>大催化剂：</span></div><div class="t m0 x9 h7 y13 ff5 fs5 fc2 sc0 ls0 ws0">•<span class="_ _6"> </span><span class="ff1">短期：<span class="ff2">半导体景气周期秉持“设<span class="_ _4"></span>备先行，制造<span class="_ _4"></span>接力，材料缺<span class="_ _4"></span>货”的规律，<span class="_ _4"></span>已进入以“硅<span class="_ _4"></span>片危机”为特</span></span></div><div class="t m0 xa h7 y14 ff2 fs5 fc2 sc0 ls0 ws0">征的“材料缺货”阶段。量价齐<span class="_ _4"></span>升是材料明年<span class="_ _4"></span>的主旋律。</div><div class="t m0 x9 h7 y15 ff5 fs5 fc2 sc0 ls0 ws0">•<span class="_ _6"> </span><span class="ff1">中期：<span class="ff2">验证的成功与否决定了国<span class="_ _4"></span>内材料公司“<span class="_ _4"></span>从<span class="ff3">0</span>到<span class="ff3">1</span>”的突破。封装材料<span class="_ _4"></span>凭借更高的国<span class="_ _4"></span>产率和国内<span class="_ _4"></span>更</span></span></div><div class="t m0 xa h9 y16 ff2 fs6 fc2 sc0 ls1 ws0">成熟的<span class="ff3 ls0">OSA<span class="_ _7"></span>T<span class="ff2">体系，在验证<span class="_ _4"></span>阶段较制造材<span class="_ _4"></span>料存在<span class="_ _4"></span>优势，在中<span class="_ _4"></span>期维度方<span class="_ _4"></span>面较制<span class="_ _4"></span>造材料更具<span class="_ _4"></span>亮点。</span></span></div><div class="t m0 x9 h7 y17 ff5 fs5 fc2 sc0 ls0 ws0">•<span class="_ _6"> </span><span class="ff1">长期：<span class="ff2">未来<span class="ff3">3</span>年，中资晶圆厂产能将大<span class="_ _4"></span>幅增长。制造<span class="_ _4"></span>材料凭借更高<span class="_ _4"></span>的国产化潜力<span class="_ _4"></span>和中资晶圆厂<span class="_ _4"></span>产能的</span></span></div><div class="t m0 xa h7 y18 ff2 fs5 fc2 sc0 ls0 ws0">快速扩充，在长期维度方面较封<span class="_ _4"></span>装材料更具看<span class="_ _4"></span>点。</div><div class="t m0 x4 h7 y19 ff4 fs5 fc2 sc0 ls0 ws0">⚫<span class="_ _3"> </span><span class="ff1">投资策略：<span class="ff2">目前大量国内半导体材料，<span class="_ _4"></span>正处于“从<span class="ff3">0<span class="_ _4"></span><span class="ff2">到<span class="ff3">1</span>”的验证关键阶段<span class="_ _4"></span>，选股策略上<span class="_ _4"></span>我们建议关注<span class="_ _4"></span>：</span></span></span></span></div><div class="t m0 x8 h7 y1a ff2 fs5 fc2 sc0 ls0 ws0">（<span class="ff3">1</span><span class="ls2">）各公司的技术水平是否有在产品<span class="_ _4"></span>性能上缩小与<span class="_ _4"></span>国际巨头差距<span class="_ _4"></span>的实力（国产<span class="_ _4"></span>替代基础）；<span class="_ _4"></span>（<span class="_ _8"></span><span class="ff3 ls0">2<span class="ff2">）半导体</span></span></span></div><div class="t m0 x8 h7 y1b ff2 fs5 fc2 sc0 ls0 ws0">材料各细分领域的龙头企业（国<span class="_ _4"></span>内的市场地位<span class="_ _4"></span>）；（<span class="ff3">3</span>）公司获取资源及<span class="_ _4"></span>平台化整合的<span class="_ _4"></span>能力（公司成<span class="_ _4"></span>长空</div><div class="t m0 x8 h9 y1c ff2 fs6 fc2 sc0 ls1 ws0">间）；（<span class="ff3 ls0">4<span class="ff2">）公司营收及业绩增<span class="_ _4"></span>长情况<span class="_ _4"></span>（国产化进<span class="_ _4"></span>程）。</span></span></div><div class="t m0 x4 h7 y1d ff4 fs5 fc2 sc0 ls0 ws0">⚫<span class="_ _3"> </span><span class="ff2">半导体材料投资机会来自晶圆厂<span class="_ _4"></span>和<span class="ff3">OSA<span class="_ _7"></span>T<span class="ff2">产业链的国产<span class="_ _4"></span>替代，建议关<span class="_ _4"></span>注相关产业链<span class="_ _4"></span>标的：</span></span></span></div><div class="t m0 x9 h7 y1e ff5 fs5 fc2 sc0 ls0 ws0">•<span class="_ _6"> </span><span class="ff1">制造材料：<span class="ff2">沪硅产业、立昂微、<span class="_ _4"></span>中环股份、神<span class="_ _4"></span>工股份、中晶<span class="_ _4"></span>科技、晶瑞电<span class="_ _4"></span>材、南大光电<span class="_ _4"></span>、彤程新材、</span></span></div><div class="t m0 xa h7 y1f ff2 fs5 fc2 sc0 ls0 ws0">雅克科技、华懋科技、金宏气体<span class="_ _4"></span>、华特气体、<span class="_ _4"></span>杭氧股份、正<span class="_ _4"></span>帆科技、安集<span class="_ _4"></span>科技、鼎龙股<span class="_ _4"></span>份、上海新</div><div class="t m0 xa h7 y20 ff2 fs5 fc2 sc0 ls0 ws0">阳、江化微、巨化股份、光华科<span class="_ _4"></span>技、江丰电子<span class="_ _4"></span>、隆华科技、<span class="_ _4"></span>有研新材、飞<span class="_ _4"></span>凯材料、容大<span class="_ _4"></span>感光、凯美特</div><div class="t m0 xa h9 y21 ff2 fs6 fc2 sc0 ls1 ws0">气、新宙邦、兴发集团、多氟多<span class="_ _4"></span>等</div><div class="t m0 x9 h7 y22 ff5 fs5 fc2 sc0 ls0 ws0">•<span class="_ _6"> </span><span class="ff1">封装材料：<span class="ff2">兴森科技、深南电路<span class="_ _4"></span>、康强电子、<span class="_ _4"></span>胜宏科技、崇<span class="_ _4"></span>达技术、三环<span class="_ _4"></span>集团、国瓷材<span class="_ _4"></span>料等</span></span></div></div></div><div class="pi" data-data='{"ctm":[1.333333,0.000000,0.000000,1.333333,0.000000,0.000000]}'></div></div>
<div id="pf3" class="pf w0 h0" data-page-no="3"><div class="pc pc3 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://static.pudn.com/prod/directory_preview_static/62862884b305d84a4f6d45cd/bg3.jpg"><div class="c x0 y1 w2 h0"><div class="t m0 xb ha y23 ff1 fs3 fc3 sc0 ls1 ws0">目录</div><div class="t m0 xc hb y24 ff1 fs7 fc3 sc0 ls0 ws0">一、半导体材料投资逻辑框架</div><div class="t m0 xd hb y25 ff1 fs7 fc3 sc0 ls0 ws0">半导体材料投资逻辑地图</div><div class="t m0 xc hc y26 ff1 fs8 fc4 sc0 ls1 ws0">四、半导体材料投资展望及核心标的</div><div class="t m0 xd hb y27 ff1 fs7 fc3 sc0 ls0 ws0">八大半导体制造材料投资地图</div><div class="t m0 xe hb y28 ff1 fs7 fc4 sc0 ls0 ws0">三、驱动半导体材料成长的三大催化剂</div><div class="t m0 xe hb y29 ff1 fs7 fc4 sc0 ls0 ws0">二、详解半导体八大制造材料：从<span class="ff6">0</span>到<span class="ff6">1</span></div><div class="t m0 xd hb y2a ff1 fs7 fc3 sc0 ls0 ws0">半导体材料三大催化剂</div></div></div><div class="pi" data-data='{"ctm":[1.333333,0.000000,0.000000,1.333333,0.000000,0.000000]}'></div></div>
<div id="pf4" class="pf w0 h0" data-page-no="4"><div class="pc pc4 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://static.pudn.com/prod/directory_preview_static/62862884b305d84a4f6d45cd/bg4.jpg"><div class="c x0 y1 w2 h0"><div class="t m0 x6 h7 ya ff2 fs5 fc0 sc0 ls0 ws0">资料来源：<span class="ff3">mordorint<span class="_ _4"></span>elligence<span class="ff2 ls2">，前瞻产业研究院，<span class="_ _4"></span>方正证券研究<span class="_ _4"></span>所整理</span></span></div><div class="t m0 x7 h8 yb ff1 fs4 fc2 sc0 ls0 ws0">半导体材料投资地图：市场稳健增长，国产替代加速推进</div><div class="t m0 xf hd y2b ff1 fs9 fc2 sc0 ls1 ws0">半导体材料全球市场规模</div><div class="t m0 x10 he y2c ff6 fs5 fc0 sc0 ls5 ws0">553</div><div class="t m0 x11 he y2d ff1 fs5 fc0 sc0 ls0 ws0">亿美元</div><div class="t m0 x12 h8 y2e ff6 fs4 fc0 sc0 ls0 ws0">698.1</div><div class="t m0 x13 h8 y2f ff1 fs4 fc0 sc0 ls0 ws0">亿美元</div><div class="t m0 x14 hf y30 ff6 fsa fc2 sc0 ls6 ws0">2020<span class="ff1 ls0">年</span></div><div class="t m0 x15 h10 y31 ff6 fsb fc2 sc0 ls7 ws0">2026<span class="ff1 ls0">年</span></div><div class="t m0 x16 hc y32 ff1 fs8 fc0 sc0 ls1 ws0">半导体</div><div class="t m0 x17 hb y33 ff1 fs7 fc0 sc0 ls0 ws0">制造材料</div><div class="t m0 x16 hb y34 ff1 fs7 fc0 sc0 ls0 ws0">半导体</div><div class="t m0 x17 hb y35 ff1 fs7 fc0 sc0 ls0 ws0">封装材料</div><div class="t m0 x18 h6 y36 ff2 fs4 fc0 sc0 ls0 ws0">硅片</div><div class="t m0 x19 h6 y37 ff2 fs4 fc0 sc0 ls0 ws0">电子气体</div><div class="t m0 x1a h6 y38 ff2 fs4 fc0 sc0 ls0 ws0">光刻胶及配套试剂</div><div class="t m0 x19 h6 y39 ff2 fs4 fc0 sc0 ls0 ws0">光掩膜版</div><div class="t m0 x1b h5 y3a ff2 fs3 fc0 sc0 ls1 ws0">湿电子化学品</div><div class="t m0 x19 h5 y3b ff2 fs3 fc0 sc0 ls1 ws0">溅射靶材</div><div class="t m0 x19 h6 y3c ff2 fs4 fc0 sc0 ls0 ws0">封装基板</div><div class="t m0 x1c h6 y3d ff3 fs4 fc0 sc0 ls0 ws0">CMP</div><div class="t m0 x19 h6 y3e ff2 fs4 fc0 sc0 ls0 ws0">引线框架</div><div class="t m0 x1d h5 y3f ff2 fs3 fc0 sc0 ls0 ws0">键合线</div><div class="t m0 x19 h6 y40 ff2 fs4 fc0 sc0 ls0 ws0">陶瓷基板</div><div class="t m0 x19 h6 y41 ff2 fs4 fc0 sc0 ls0 ws0">包装材料</div><div class="t m0 x18 h6 y42 ff2 fs4 fc0 sc0 ls0 ws0">其他</div><div class="t m0 x1e h6 y43 ff2 fs4 fc0 sc0 ls0 ws0">芯片粘结材料</div><div class="t m0 x1f h11 y44 ff7 fs8 fc2 sc0 ls0 ws0">63.1%</div><div class="t m0 x1f h12 y45 ff7 fs7 fc2 sc0 ls0 ws0">36.9%</div><div class="t m0 x17 h8 y46 ff6 fs4 fc2 sc0 ls8 ws0">349<span class="ff1 ls0">亿美元</span></div><div class="t m0 x17 h8 y47 ff6 fs4 fc2 sc0 ls8 ws0">204<span class="ff1 ls0">亿美元</span></div><div class="t m0 x20 h8 y48 ff6 fs4 fc0 sc0 ls8 ws0">2020<span class="ff1 ls2">市场格局</span></div><div class="t m0 x21 h8 y49 ff1 fs4 fc0 sc0 ls0 ws0">晶圆厂<span class="_ _9"> </span><span class="ff6">OSA<span class="_ _7"></span>T</span></div><div class="t m0 x22 h8 y4a ff1 fs4 fc0 sc0 ls0 ws0">国产替代</div><div class="t m0 x23 h8 y4b ff1 fs4 fc0 sc0 ls0 ws0">半导体材料</div><div class="t m0 x24 h8 y4c ff1 fs4 fc0 sc0 ls0 ws0">产业链</div><div class="t m0 x1 h13 y4d ff1 fs6 fc0 sc0 ls0 ws0">重</div><div class="t m0 x1 he y4e ff1 fs5 fc0 sc0 ls0 ws0">塑</div></div></div><div class="pi" data-data='{"ctm":[1.333333,0.000000,0.000000,1.333333,0.000000,0.000000]}'></div></div>
<div id="pf5" class="pf w0 h0" data-page-no="5"><div class="pc pc5 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://static.pudn.com/prod/directory_preview_static/62862884b305d84a4f6d45cd/bg5.jpg"><div class="c x0 y1 w2 h0"><div class="t m0 x7 h8 yb ff1 fs4 fc2 sc0 ls0 ws0">各类半导体材料在半导体制造和封测应用环节</div><div class="t m0 x6 h7 ya ff2 fs5 fc0 sc0 ls0 ws0">资料来源：方正证券研究所</div><div class="t m0 x25 hd y4f ff1 fs9 fc0 sc0 ls1 ws0">切筋<span class="ff6 ls0">/</span>成型</div><div class="t m0 x26 h10 y50 ff1 fsb fc0 sc0 ls0 ws0">模塑</div><div class="t m0 x27 h10 y51 ff1 fsb fc0 sc0 ls0 ws0">引线键合<span class="_ _a"></span><span class="ls2">贴片</span></div><div class="t m0 x28 h10 y52 ff1 fsb fc0 sc0 ls0 ws0">晶圆切割</div><div class="t m0 x29 h10 y53 ff1 fsb fc0 sc0 ls0 ws0">减薄</div><div class="t m0 x2a h10 y54 ff6 fsb fc0 sc0 ls9 ws0">CP<span class="ff1 ls0">测试</span></div><div class="t m0 x2b h10 y55 ff1 fsb fc0 sc0 ls0 ws0">研磨抛光</div><div class="t m0 x2c h10 y56 ff1 fsb fc0 sc0 ls0 ws0">切割</div><div class="t m0 x2c hd y57 ff1 fs9 fc0 sc0 ls0 ws0">拉晶</div><div class="t m0 x2c h10 y58 ff1 fsb fc0 sc0 ls2 ws0">清洗</div><div class="t m0 x8 h10 y59 ff1 fsb fc0 sc0 ls0 ws0">多晶硅</div><div class="t m0 x2d h10 y5a ff1 fsb fc2 sc0 ls2 ws0">硅片制造厂</div><div class="t m0 x2e h10 y5b ff1 fsb fc0 sc0 ls0 ws0">前烘</div><div class="t m0 x2f h10 y5c ff1 fsb fc0 sc0 ls0 ws0">涂胶</div><div class="t m0 x30 h10 y5b ff1 fsb fc0 sc0 ls0 ws0">沉积<span class="_ _b"> </span>氧化<span class="_ _c"></span>清洗<span class="_ _d"></span>单晶硅片</div><div class="t m0 x31 h10 y5d ff6 fsb fc0 sc0 ls0 ws0">W<span class="_ _e"></span>A<span class="_ _7"></span>T<span class="ff1">测试</span></div><div class="t m0 x32 h10 y5e ff1 fsb fc0 sc0 ls0 ws0">研磨抛光</div><div class="t m0 x33 h10 y5f ff1 fsb fc0 sc0 ls2 ws0">薄膜生长</div><div class="t m0 x34 h10 y60 ff1 fsb fc0 sc0 ls0 ws0">离子注入</div><div class="t m0 x35 h10 y61 ff1 fsb fc0 sc0 ls0 ws0">曝光</div><div class="t m0 x35 h10 y62 ff1 fsb fc0 sc0 ls0 ws0">显影</div><div class="t m0 x36 h10 y63 ff1 fsb fc0 sc0 ls0 ws0">后烘</div><div class="t m0 x35 h10 y64 ff1 fsb fc0 sc0 ls0 ws0">去胶</div><div class="t m0 x37 h10 y65 ff1 fsb fc0 sc0 ls0 ws0">金属化</div><div class="t m0 x38 h7 y66 ff2 fs5 fc2 sc0 ls0 ws0">硅片</div><div class="t m0 x39 h7 y67 ff2 fs5 fc2 sc0 ls0 ws0">电子气体</div><div class="t m0 x3a h7 y68 ff2 fs5 fc2 sc0 ls0 ws0">湿电子化学</div><div class="t m0 x3b h7 y69 ff2 fs5 fc2 sc0 ls0 ws0">靶材</div><div class="t m0 x2f h7 y6a ff2 fs5 fc2 sc0 ls0 ws0">光刻胶</div><div class="t m0 x3c h7 y6b ff2 fs5 fc2 sc0 ls0 ws0">湿电子化学</div><div class="t m0 x3d h9 y6c ff2 fs6 fc2 sc0 ls1 ws0">高纯试剂</div><div class="t m0 x1a h7 y6d ff2 fs5 fc2 sc0 ls0 ws0">电子气体</div><div class="t m0 x3e h7 y6e ff2 fs5 fc2 sc0 ls0 ws0">前驱体</div><div class="t m0 x26 h9 y6f ff2 fs6 fc2 sc0 ls1 ws0">靶材</div><div class="t m0 x3f h7 y70 ff3 fs5 fc2 sc0 lsa ws0">CMP<span class="ff2 ls0">材料</span></div><div class="t m0 x40 h7 y71 ff2 fs5 fc2 sc0 ls0 ws0">靶材</div><div class="t m0 x31 h10 y72 ff6 fsb fc0 sc0 ls0 ws0">ED<span class="_ _4"></span>A</div><div class="t m0 x41 h10 y73 ff1 fsb fc0 sc0 ls0 ws0">电路设计</div><div class="t m0 x42 h10 y72 ff6 fsb fc0 sc0 lsb ws0">IP</div><div class="t m0 x43 h10 y74 ff6 fsb fc2 sc0 lsb ws0">IC<span class="ff1 ls0">设计</span></div><div class="t m0 x44 h10 y75 ff6 fsb fc0 sc0 lsc ws0">FT<span class="ff1 ls0">测试</span></div><div class="t m0 x45 h7 y76 ff2 fs5 fc2 sc0 ls0 ws0">封装基板</div><div class="t m0 x45 h7 y77 ff2 fs5 fc2 sc0 ls0 ws0">引线框架</div><div class="t m0 x46 h7 y78 ff2 fs5 fc2 sc0 ls0 ws0">键合丝</div><div class="t m0 x47 h7 y79 ff2 fs5 fc2 sc0 ls0 ws0">封装基板</div><div class="t m0 x48 hb y7a ff6 fs7 fc2 sc0 lsd ws0">IC<span class="ff1 ls2">封测</span></div><div class="t m0 x35 h10 y7b ff1 fsb fc0 sc0 ls0 ws0">刻蚀</div><div class="t m0 x49 h7 y7c ff2 fs5 fc2 sc0 ls0 ws0">光掩膜板</div><div class="t m0 x4a h7 y7d ff2 fs5 fc2 sc0 ls0 ws0">电子特气</div><div class="t m0 x3c h7 y7e ff2 fs5 fc2 sc0 ls0 ws0">湿电子化学</div><div class="t m0 x4b he y7f ff1 fs5 fc0 sc0 ls0 ws0">利用掩膜板重复若干次</div><div class="t m0 x4c h7 y80 ff2 fs5 fc2 sc0 ls0 ws0">塑封料</div><div class="t m0 x4c h7 y81 ff2 fs5 fc2 sc0 ls0 ws0">硅微粉</div><div class="t m0 x4d hb y82 ff6 fs7 fc2 sc0 lsd ws0">IC<span class="ff1 ls0">制造</span></div><div class="t m0 x4e hd y83 ff6 fs9 fc0 sc0 ls0 ws0">CAD</div><div class="t m0 x4f h10 y84 ff1 fsb fc0 sc0 ls0 ws0">版图设计</div><div class="t m0 x50 h10 y85 ff1 fsb fc0 sc0 ls0 ws0">光罩设计</div><div class="t m0 x51 hd y86 ff1 fs9 fc2 sc0 ls1 ws0">光掩模设计</div></div></div><div class="pi" data-data='{"ctm":[1.333333,0.000000,0.000000,1.333333,0.000000,0.000000]}'></div></div>
