<html xmlns="http://www.w3.org/1999/xhtml"><head><meta charset="utf-8"><meta name="generator" content="pdf2htmlEX"><meta http-equiv="X-UA-Compatible" content="IE=edge,chrome=1"><link rel="stylesheet" href="https://csdnimg.cn/release/download_crawler_static/css/base.min.css"><link rel="stylesheet" href="https://csdnimg.cn/release/download_crawler_static/css/fancy.min.css"><link rel="stylesheet" href="https://csdnimg.cn/release/download_crawler_static/5730397/raw.css"><script src="https://csdnimg.cn/release/download_crawler_static/js/compatibility.min.js"></script><script src="https://csdnimg.cn/release/download_crawler_static/js/pdf2htmlEX.min.js"></script><script>try{pdf2htmlEX.defaultViewer = new pdf2htmlEX.Viewer({});}catch(e){}</script><title></title></head><body><div id="sidebar" style="display: none"><div id="outline"></div></div><div id="pf1" class="pf w0 h0" data-page-no="1"><div class="pc pc1 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://csdnimg.cn/release/download_crawler_static/5730397/bg1.jpg"><div class="t m0 x1 h2 y1 ff1 fs0 fc0 sc0 ls0 ws0">资料收藏<span class="_"> </span><span class="ff2 ls1">http://www.maihui.net PCB<span class="_ _0"> </span></span>收藏天地<span class="ff2 ls1"> PCB<span class="_ _0"> </span></span>制造流程及说明<span class="ff2"> </span></div><div class="t m0 x2 h3 y2 ff3 fs1 fc1 sc0 ls2 ws0">PCB<span class="_"> </span><span class="ff1 sc1 ls3">制造流程及说明</span><span class="ls0"> </span></div><div class="t m0 x1 h4 y3 ff1 fs2 fc1 sc1 ls0 ws0">一<span class="ff3 sc0 ls4 ws1">. PCB<span class="_"> </span></span><span class="ls5">演变<span class="ff3 sc0 ls6"> </span></span></div><div class="t m0 x1 h5 y4 ff4 fs3 fc1 sc0 ls7 ws2">1.1 PCB<span class="_"> </span><span class="ff1 ls0 ws0">扮演的角色<span class="ff4"> </span></span></div><div class="t m0 x1 h6 y5 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls9">PCB<span class="_ _0"> </span><span class="ff1 lsa">的功能为提供完成第一层级构装的组件与其它必须的电子电路零件接</span><span class="ls0"> <span class="_"> </span><span class="ff1">合的基地</span></span></span></div><div class="t m0 x1 h5 y6 ff1 fs3 fc1 sc0 ls0 ws0">以组成一个具特定功能的模块或成品<span class="_"> </span>所以<span class="_ _1"> </span><span class="ff4 ls9">PCB<span class="_"> </span></span>在整个电子产<span class="ff4"> <span class="_"> </span></span>品中<span class="_"> </span>扮演了整合连结总</div><div class="t m0 x1 h5 y7 ff1 fs3 fc1 sc0 ls0 ws0">其成所有功能的角色<span class="_"> </span>也因此时常电子产品功能故<span class="ff4"> <span class="_"> </span></span>障时<span class="_"> </span>最先被质疑往往就是<span class="_ _1"> </span><span class="ff4 ls9">PCB<span class="_ _2"> </span></span>图</div><div class="t m0 x1 h5 y8 ff4 fs3 fc1 sc0 ls0 ws0">1.1<span class="_"> </span><span class="ff1">是电子构装层级区分示意<span class="_"> </span></span> </div><div class="t m0 x1 h5 y9 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 ya ff4 fs3 fc1 sc0 ls7 ws2">1.2 PCB<span class="_"> </span><span class="ff1 ls0 ws0">的演变<span class="ff4"> </span></span></div><div class="t m0 x1 h6 yb ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0">1.<span class="ff1">早于<span class="_ _1"> </span></span>1903<span class="_"> </span><span class="ff1">年<span class="_ _1"> </span></span><span class="ls7 ws2">Mr<span class="_ _3"></span>. Albert Hanson<span class="_"> </span><span class="ff1 ls0 ws0">首创利用<span class="ff4">"</span>线路<span class="ff4 lsb">"(Circuit)</span><span class="lsc">观念应用于电话交换机系统</span></span></span></span></div><div class="t m0 x1 h7 yc ff1 fs3 fc1 sc0 ls0 ws0">它是用金属箔予以切割成线路导体<span class="_"> </span>将之黏着于石蜡纸上<span class="_"> </span>上面同样贴上一层石蜡纸<span class="_"> </span>成</div><div class="t m0 x1 h5 yd ff1 fs3 fc1 sc0 ls0 ws0">了现今<span class="_ _1"> </span><span class="ff4 ls9">PCB<span class="_"> </span></span>的机构雏型<span class="_"> </span>见图<span class="_ _1"> </span><span class="ff4">1.2 </span></div><div class="t m0 x1 h6 ye ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0 ws3"> 2. <span class="ff1 ws0">至<span class="_ _1"> </span><span class="ff4">1936<span class="_"> </span></span>年<span class="_"> </span></span><span class="lsd ws4">Dr Paul Eisner<span class="_"> </span></span><span class="ff1 ws0">真正发明了<span class="_ _1"> </span><span class="ff4 ls9">PCB<span class="_"> </span></span>的制作技术<span class="_"> </span>也发表多项专利<span class="_"> </span>而今</span></span></div><div class="t m0 x1 h5 yf ff1 fs3 fc1 sc0 ls0 ws0">日之<span class="_ _1"> </span><span class="ff4 lse ws5">print-etch (photo image transfer)</span>的技术<span class="_"> </span>就是沿袭其发明而来的<span class="_"> </span><span class="ff4 lsf"> </span></div><div class="t m0 x1 h5 y10 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y11 ff4 fs3 fc1 sc0 ls7 ws2">1.3 PCB<span class="_"> </span><span class="ff1 ls0 ws0">种类及制法<span class="ff4"> </span></span></div><div class="t m0 x1 h6 y12 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">在材料<span class="_ _4"> </span>层次<span class="_ _4"> </span>制程上的多样化以适<span class="ff4"> <span class="_"> </span></span>合<span class="ff4"> <span class="_"> </span></span>不同的电子产品及其特殊需求<span class="_ _4"> </span><span class="ff4"> <span class="_"> </span></span>以下就归纳</span></div><div class="t m0 x1 h5 y13 ff1 fs3 fc1 sc0 ls0 ws0">一些通用的区别办法<span class="_"> </span>来简单介绍<span class="_ _1"> </span><span class="ff4 ls9">PCB<span class="_"> </span></span>的分类以及它的制造方<span class="ff4"> <span class="_"> </span></span>法<span class="_"> </span><span class="ff4 lsf"> </span></div><div class="t m0 x1 h5 y14 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y15 ff4 fs3 fc1 sc0 lsc ws6">1.3.1 PCB<span class="_"> </span><span class="ff1 ls0 ws0">种类<span class="ff4"> </span></span></div><div class="t m0 x1 h6 y16 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls10">A. <span class="_"> </span><span class="ff1 ls0">以材质分</span><span class="lsf"> </span></span></div><div class="t m0 x1 h6 y17 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls11 ws7"> a. </span><span class="ff1 ls0">有机材质<span class="ff4 lsf"> </span></span></div><div class="t m0 x1 h6 y18 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0"> <span class="_"> </span><span class="ff1">酚醛树脂<span class="_"> </span>玻璃纤维</span>/<span class="ff1">环氧树脂<span class="_"> </span></span><span class="ls12">Polyamide<span class="_ _2"> </span><span class="ls13">BT/Epoxy<span class="_"> </span></span></span><span class="ff1">等皆属之<span class="_"> </span></span> </span></div><div class="t m0 x1 h6 y19 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0 ws3"> b. <span class="ff1 ws0">无机材质<span class="ff4 lsf"> </span></span></span></div><div class="t m0 x1 h6 y1a ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0"> <span class="_"> </span><span class="ff1">铝<span class="_"> </span></span><span class="ls12 ws8">Copper Inver-copper<span class="_ _2"> </span></span><span class="ls14">ceramic<span class="_"> </span></span><span class="ff1">等皆属之<span class="_"> </span>主要取其散热功能</span><span class="lsf"> </span></span></div><div class="t m0 x1 h6 y1b ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls15">B. <span class="_"> </span><span class="ff1 ls0">以成品软硬区分</span><span class="lsf"> </span></span></div><div class="t m0 x1 h6 y1c ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls11 ws7"> a. </span><span class="ff1 ls0">硬板<span class="ff4 ls7 ws9"> Rigid <span class="_ _5"></span>PCB </span></span></div><div class="t m0 x1 h6 y1d ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0 ws3"> b.<span class="ff1 ws0">软板</span> Flexible <span class="_ _5"></span>PCB <span class="ff1 ws0">见图<span class="_ _1"> </span></span>1.3 </span></div><div class="t m0 x1 h6 y1e ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls16 wsa"> c.</span><span class="ff1 ls0">软硬板<span class="ff4 ws3"> Rigid-Flex <span class="_ _5"></span>PCB <span class="ff1 ws0">见图<span class="_ _1"> </span></span>1.4 </span></span></div><div class="t m0 x1 h6 y1f ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls15">C. <span class="_"> </span><span class="ff1 ls0">以结构分</span><span class="lsf"> </span></span></div><div class="t m0 x1 h6 y20 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls16 wsa"> a.</span><span class="ff1 ls0">单面板<span class="ff4"> <span class="_"> </span></span>见图<span class="_ _1"> </span><span class="ff4 ws3">1.5 </span></span></div><div class="t m0 x1 h6 y21 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0 ws3"> b.<span class="ff1 ws0">双面板<span class="ff4"> <span class="_"> </span></span>见图<span class="_ _1"> </span></span>1.6 </span></div><div class="t m0 x1 h6 y22 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls16 wsa"> c.</span><span class="ff1 ls0">多层板<span class="ff4"> <span class="_"> </span></span>见图<span class="_ _1"> </span><span class="ff4 ws3">1.7 </span></span></div><div class="t m0 x1 h6 y23 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls10">D. <span class="_"> </span><span class="ff1 ls0">依用途分<span class="_"> </span>通信<span class="ff4">/</span>耗用性电子<span class="ff4">/</span>军用<span class="ff4">/</span>计算机<span class="ff4">/</span>半导体<span class="ff4">/</span>电测板<span class="_"> </span><span class="ff4">,</span>见图<span class="_ _1"> </span></span><span class="ls17 wsb">1.8 BGA. </span></span></div><div class="t m0 x1 h6 y24 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0"> <span class="_"> </span><span class="ff1">另有一种射出成型的立体<span class="_ _1"> </span></span><span class="ls9">PCB<span class="_ _2"> </span></span><span class="ff1">因使用少<span class="_"> </span>不在此介绍<span class="_"> </span></span> </span></div><div class="t m0 x1 h5 y25 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y26 ff4 fs3 fc1 sc0 ls0 ws0">1.3.2<span class="_"> </span><span class="ff1">制造方法介绍</span> </div><div class="t m0 x1 h6 y27 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls10">A. <span class="_"> </span><span class="ff1 ls0">减除法<span class="_"> </span>其流程见图<span class="_ _1"> </span><span class="ff4 ws3">1.9 </span></span></span></div><div class="t m0 x1 h8 y28 ff4 fs4 fc1 sc0 ls0 ws0"> </div><div class="t m0 x3 h9 y29 ff3 fs3 fc1 sc0 ls0 ws0">1 </div></div><div class="pi" data-data='{"ctm":[1.611639,0.000000,0.000000,1.611639,0.000000,0.000000]}'></div></div></body></html>
<div id="pf2" class="pf w0 h0" data-page-no="2"><div class="pc pc2 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://csdnimg.cn/release/download_crawler_static/5730397/bg2.jpg"><div class="t m0 x1 h2 y1 ff1 fs0 fc0 sc0 ls0 ws0">资料收藏<span class="_"> </span><span class="ff2 ls1">http://www.maihui.net PCB<span class="_ _0"> </span></span>收藏天地<span class="ff2 ls1"> PCB<span class="_ _0"> </span></span>制造流程及说明<span class="ff2"> </span></div><div class="t m0 x1 h6 y2a ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls15">B. <span class="_"> </span><span class="ff1 ls0">加成法</span></span></div><div class="t m0 x4 h5 y2b ff1 fs3 fc1 sc0 ls0 ws0">又可分半加成与全加成法<span class="_"> </span>见图<span class="_ _1"> </span><span class="ff4">1.10 1.1<span class="_ _3"></span>1 </span></div><div class="t m0 x1 h6 y2c ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls15">C. <span class="_"> </span><span class="ff1 ls0">尚有其它因应<span class="_ _1"> </span></span><span class="ls18">IC<span class="_"> </span><span class="ff1 ls0">封装的变革延伸而出的一些先进制程<span class="_"> </span>本光盘仅提及但不详加介</span></span></span></div><div class="t m0 x1 h5 y2d ff1 fs3 fc1 sc0 ls0 ws0">绍<span class="_ _4"> </span>因有许多尚属机密也不易取得<span class="_ _4"> </span>或者成熟度尚不够<span class="_ _4"> </span><span class="ff4"> <span class="_"> </span></span>本光盘以传统负片多层板的制程</div><div class="t m0 x1 h5 y2e ff1 fs3 fc1 sc0 ls0 ws0">为主轴<span class="_"> </span>深入浅出的介绍各个制程<span class="_"> </span>再辅以先进技术的观念来探讨未来的<span class="_ _1"> </span><span class="ff4 ls9">PCB<span class="_"> </span></span>走势<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h4 y2f ff1 fs2 fc1 sc1 ls0 ws0">二<span class="ff3 sc0">.</span><span class="ls5">制前准备</span><span class="ff3 sc0"> </span></div><div class="t m0 x1 h5 y6 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y7 ff4 fs3 fc1 sc0 ls0 ws0">2.1.<span class="ff1">前言</span> </div><div class="t m0 x1 h5 y8 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y9 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">台湾<span class="_ _1"> </span><span class="ff4 ls9">PCB<span class="_"> </span></span>产业属性<span class="_"> </span>几乎是以<span class="_ _6"> </span>也就是受客户委托制作空板<span class="_"> </span><span class="ff4 ls19 wsc">Bare Board<span class="_ _2"> </span></span>而</span></div><div class="t m0 x1 h5 ya ff1 fs3 fc1 sc0 ls0 ws0">已<span class="_ _7"> </span>不像美国<span class="_ _7"> </span>很多<span class="_ _1"> </span><span class="ff4 ls10 wsd">PCB Shop<span class="_"> </span></span><span class="ls11">是包括了线路设计<span class="_ _7"> </span></span>空板制作以及装配<span class="ff4 lsd">(Assembly)</span>的<span class="_ _1"> </span><span class="ff4 ls1a">T<span class="_ _3"></span>urn-Key</span></div><div class="t m0 x1 h5 yb ff1 fs3 fc1 sc0 ls0 ws0">业务<span class="_"> </span>以前<span class="_"> </span>只要客户提供的原始数据如<span class="_ _1"> </span><span class="ff4 lsa wse">Drawing, Artwork, Specification<span class="_ _2"> </span></span><span class="ls17">再以手动翻片</span></div><div class="t m0 x1 h5 yc ff1 fs3 fc1 sc0 ls0 ws0">排版<span class="_"> </span>打带等作业<span class="_"> </span>即可进行制作<span class="_ _8"> </span>但近年由于电子产品日趋轻薄短小<span class="_"> </span><span class="ff4 ls9">PCB<span class="_"> </span></span><span class="ls1b">的制造面临</span></div><div class="t m0 x1 h5 yd ff1 fs3 fc1 sc0 ls0 ws0">了几个挑战<span class="ff4">:<span class="_ _8"> </span>1<span class="_ _8"> </span></span>薄板<span class="_ _8"> </span><span class="ff4">2<span class="_ _9"> </span></span>高密度<span class="_ _9"> </span><span class="ff4">3<span class="_ _8"> </span></span>高性能<span class="_ _8"> </span><span class="ff4">4<span class="_ _8"> </span></span>高速<span class="ff4 ls1c wsf"> <span class="_"> </span>( 5 ) <span class="_"> </span></span>产品周期缩短<span class="_ _9"> </span><span class="ff4">6<span class="_ _8"> </span></span>降低成</div><div class="t m0 x1 h7 ye ff1 fs3 fc1 sc0 ls0 ws0">本等<span class="_"> </span>以往以灯桌<span class="_"> </span>笔刀<span class="_"> </span>贴图及照相机做为制前工具<span class="_"> </span>现在己被计算机<span class="_"> </span>工作软件及激</div><div class="t m0 x1 h5 yf ff1 fs3 fc1 sc0 ls0 ws0">光绘图机所取代<span class="_"> </span>过去<span class="_"> </span>以手工排版<span class="_"> </span>或者还需要<span class="_ _1"> </span><span class="ff4 ls1d">Micro-Modifier<span class="_"> </span></span>来修正尺寸等费时耗工</div><div class="t m0 x1 h5 y10 ff1 fs3 fc1 sc0 ls0 ws0">的作业<span class="_"> </span>今天只要在<span class="_ _1"> </span><span class="ff4 ls1e ws10">CAM(Computer Aided Manufacturing)</span>工作人员取得客户的设计资料</div><div class="t m0 x1 h5 y11 ff1 fs3 fc1 sc0 ls0 ws0">可能几小时内<span class="_"> </span>就可以依设计规则或<span class="_ _1"> </span><span class="ff4 ls19 wsc">DFM(Design For Manufacturing)</span>自动排版并变化不同</div><div class="t m0 x1 h5 y12 ff1 fs3 fc1 sc0 ls0 ws0">的生产条件<span class="_"> </span>同时可以<span class="_ _1"> </span><span class="ff4 ls12">output <span class="_"> </span></span>如钻孔<span class="_"> </span>成型<span class="_"> </span>测试治具等资料<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 y13 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y14 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y15 ff4 fs3 fc1 sc0 ls0 ws0">2.2.<span class="ff1">相关名词的定义与解说</span><span class="lsf"> </span></div><div class="t m0 x1 h5 y16 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y17 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y18 ff4 fs3 fc1 sc0 lsa wse">A Gerber file </div><div class="t m0 x1 h5 y19 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y1a ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">这是一个从<span class="_ _a"></span><span class="ff4 ls10 ws11">PCB CAD<span class="_ _a"></span></span><span class="ls1e">软件输出的数据文件做为光绘图语言<span class="_ _b"> </span></span><span class="ff4">1960<span class="_ _a"></span></span>年代一家名叫<span class="_ _a"></span><span class="ff4 lsb">Gerber </span></span></div><div class="t m0 x1 h5 y1b ff4 fs3 fc1 sc0 ls1a ws0">Scientific<span class="_ _c"> </span><span class="ff1 ls0">现在叫<span class="_ _1"> </span></span><span class="ls11 ws12">Gerber System<span class="_ _c"> </span></span><span class="ff1 ls0">专业做绘图机的美国公司所发展出的格式<span class="_ _c"> </span>尔后二十年</span></div><div class="t m0 x1 h5 y1c ff1 fs3 fc1 sc0 ls0 ws0">行销于世界四十多个国家<span class="_"> </span>几乎所有<span class="_ _1"> </span><span class="ff4 ls1f">CAD<span class="_"> </span></span>系统的发展<span class="_"> </span>也都依此格式作其<span class="_ _1"> </span><span class="ff4 lsd ws4">Output Data</span></div><div class="t m0 x1 h5 y1d ff1 fs3 fc1 sc0 ls0 ws0">直接输入绘图机就可绘出<span class="_ _1"> </span><span class="ff4 lsa">Drawing<span class="_"> </span></span>或<span class="_ _1"> </span><span class="ff4 ls1a">Film<span class="_ _2"> </span></span>因此<span class="_ _1"> </span><span class="ff4 ls1e ws10">Gerber Format<span class="_"> </span></span><span class="lsd">成了电子业界的公认标准<span class="_ _b"> </span></span><span class="ff4"> </span></div><div class="t m0 x1 h5 y1e ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y1f ff4 fs3 fc1 sc0 ls7 ws2">B. RS-274D </div><div class="t m0 x1 h5 y20 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y21 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">是<span class="_ _1"> </span><span class="ff4 ls12 ws8">Gerber Format<span class="_"> </span></span>的正式名称<span class="_"> </span>正确称呼是<span class="_ _1"> </span><span class="ff4 ls20 ws13">EIA ST<span class="_ _d"></span>ANDARD RS-274D(Electronic </span></span></div><div class="t m0 x1 h5 y22 ff4 fs3 fc1 sc0 ls1d ws14">Industries Association)<span class="ff1 ls0 ws0">主要两大组成<span class="_"> </span></span><span class="lsa wse">1.Function Code<span class="_ _2"> </span><span class="ff1 ls0 ws0">如<span class="_ _1"> </span></span><span class="ls21 ws15">G codes, D codes, M codes <span class="_"> </span><span class="ff1 ls0 ws0">等</span></span></span></div><div class="t m0 x1 h5 y23 ff4 fs3 fc1 sc0 ls12 ws8">2.Coordinate data<span class="_ _2"> </span><span class="ff1 ls0 ws0">定义图像<span class="_"> </span><span class="ff4 ls1c">imaging<span class="_ _8"> </span><span class="lsf"> </span></span></span></div><div class="t m0 x1 h5 y24 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y25 ff4 fs3 fc1 sc0 ls7 ws2">C. RS-274X <span class="_"> </span> </div><div class="t m0 x1 h5 y26 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y27 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">是<span class="_ _1"> </span><span class="ff4 ls13">RS-274D<span class="_"> </span></span>的延伸版本<span class="_"> </span>除<span class="_ _0"> </span><span class="ff4 ls13">RS-274D<span class="_"> </span></span>之<span class="_ _1"> </span><span class="ff4 ls13">Code <span class="_"> </span></span>以外<span class="_"> </span>包括<span class="_ _1"> </span><span class="ff4 ls22 ws16">RS-274X Parameters<span class="_ _8"> </span></span>或称</span></div><div class="t m0 x1 h8 y28 ff4 fs4 fc1 sc0 ls0 ws0"> </div><div class="t m0 x3 h9 y29 ff3 fs3 fc1 sc0 ls0 ws0">2 </div></div><div class="pi" data-data='{"ctm":[1.611639,0.000000,0.000000,1.611639,0.000000,0.000000]}'></div></div>
<div id="pf3" class="pf w0 h0" data-page-no="3"><div class="pc pc3 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://csdnimg.cn/release/download_crawler_static/5730397/bg3.jpg"><div class="t m0 x1 h2 y1 ff1 fs0 fc0 sc0 ls0 ws0">资料收藏<span class="_"> </span><span class="ff2 ls1">http://www.maihui.net PCB<span class="_ _0"> </span></span>收藏天地<span class="ff2 ls1"> PCB<span class="_ _0"> </span></span>制造流程及说明<span class="ff2"> </span></div><div class="t m0 x1 h5 y2a ff1 fs3 fc1 sc0 ls0 ws0">整个<span class="_ _1"> </span><span class="ff4 ls11 ws12">extended Gerber format<span class="_"> </span></span>它以两个字母为组合</div><div class="t m0 x5 h5 y2b ff1 fs3 fc1 sc0 ls0 ws0">定义了绘图过程的一些特性<span class="_"> </span><span class="ff4 lsf"> </span></div><div class="t m0 x1 h5 y2c ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y2d ff4 fs3 fc1 sc0 lsb ws17">D. IPC-350 <span class="_"> </span> </div><div class="t m0 x1 h5 y2e ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y4 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls21">IPC-350<span class="_ _e"> </span><span class="ff1 ls0">是<span class="_ _e"> </span></span><span class="ls19">IPC<span class="_ _e"> </span><span class="ff1 ls12">发展出来的一套<span class="_ _e"> </span><span class="ff4 ws8">neutral format,</span><span class="ls22">可以很容易由<span class="_ _e"> </span></span></span><span class="lse ws5">PCB CAD<span class="_ _f"></span>/CAM<span class="_ _e"> </span><span class="ff1 ls0 ws0">产生<span class="ff4">,</span>然后</span></span></span></span></div><div class="t m0 x1 h5 y5 ff1 fs3 fc1 sc0 ls0 ws0">依此系统<span class="ff4 ls9 ws18">,PCB SHOP <span class="_"> </span></span>再产生<span class="_ _1"> </span><span class="ff4 ls22 ws16">NC Drill Program,Netlist,</span>并可直接输入<span class="_ _0"> </span><span class="ff4 ls23 ws19">Laser Plotter<span class="_"> </span></span>绘制底片<span class="ff4 ws3">. </span></div><div class="t m0 x1 h5 y6 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y7 ff4 fs3 fc1 sc0 lse ws5">E. Laser Plotter <span class="_"> </span> </div><div class="t m0 x1 h5 y8 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y9 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">见图<span class="_ _1"> </span><span class="ff4">2.1,</span>输入<span class="_ _1"> </span><span class="ff4 ls11 ws12">Gerber format<span class="_"> </span></span>或<span class="_ _1"> </span><span class="ff4">IPC 350 format<span class="_"> </span></span>以绘制<span class="_ _0"> </span><span class="ff4 lsa ws1a">Artwork </span></span></div><div class="t m0 x1 h5 ya ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 yb ff4 fs3 fc1 sc0 lsd ws4">F<span class="_ _d"></span>. Aperture List and D-Codes <span class="_"> </span> </div><div class="t m0 x1 h5 yc ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 yd ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">见表<span class="ff4 ws3"> 2.1 </span>及图<span class="_ _1"> </span><span class="ff4">2.2,</span>举一简单实例来说明两者关系<span class="ff4 ls12 ws8">, Aperture<span class="_"> </span></span>的定义亦见图<span class="_ _1"> </span><span class="ff4 ws3">2.1 </span></span></div><div class="t m0 x1 h5 ye ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 yf ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y10 ff4 fs3 fc1 sc0 lsf ws0"> </div><div class="t m0 x1 h5 y11 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y12 ff4 fs3 fc1 sc0 ls0 ws0">2.3.<span class="ff1">制前设计流程<span class="_"> </span></span><span class="lsf"> </span></div><div class="t m0 x1 h5 y13 ff4 fs3 fc1 sc0 ls0 ws0">2.3.1<span class="_"> </span><span class="ff1">客户必须提供的数据<span class="_"> </span></span> </div><div class="t m0 x1 h5 y14 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y15 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">电子厂或装配工厂<span class="_"> </span>委托<span class="_ _1"> </span><span class="ff4 ls24 ws1b">PCB SHOP<span class="_"> </span></span>生产空板<span class="_"> </span><span class="ff4 ls19 wsc">Bare Board<span class="_ _2"> </span></span>时<span class="_"> </span>必须提供下列数据</span></div><div class="t m0 x1 h5 y16 ff1 fs3 fc1 sc0 ls0 ws0">以供制作<span class="_"> </span>见表料号数据表<span class="ff4">-</span>供制前设计使用<span class="ff4 ws3">. </span></div><div class="t m0 x1 h6 y17 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0"> </span></div><div class="t m0 x1 h5 y18 ff1 fs3 fc1 sc0 ls0 ws0">上表数据是必备项目<span class="_"> </span>有时客户会提供一片样品<span class="ff4">, <span class="_"> </span></span>一份零件图<span class="_"> </span>一份保证书<span class="_"> </span>保证制程中</div><div class="t m0 x1 h7 y19 ff1 fs3 fc1 sc0 ls0 ws0">使用之原物料<span class="_ _10"> </span>耗料等不含某些有毒物质<span class="_ _10"> </span>等<span class="_ _10"> </span>这些额外数据<span class="_ _10"> </span>厂商须自行判断其重要性</div><div class="t m0 x1 h5 y1a ff1 fs3 fc1 sc0 ls0 ws0">以免误了商机<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 y1b ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y1c ff4 fs3 fc1 sc0 ls0 ws0">2.3.2 .<span class="ff1">资料审查</span> </div><div class="t m0 x1 h5 y1d ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y1e ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">面对这么多的数据<span class="_"> </span>制前设计工程师接下来所要进行的工作程序与重点<span class="_"> </span>如下所述<span class="_"> </span><span class="ff4"> </span></span></div><div class="t m0 x1 h5 y1f ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y20 ff2 fs3 fc1 sc0 ls0 ws0"> <span class="_"> </span><span class="ff4 ls10">A. <span class="_"> </span></span><span class="ff1">审查客户的产品规格<span class="_ _11"> </span>是否厂内制程能力可及<span class="_ _11"> </span>审查项目见承接料号制程能力检查表<span class="ff4">. </span></span></div><div class="t m0 x1 h5 y21 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y22 ff2 fs3 fc1 sc0 ls0 ws0"> <span class="_"> </span><span class="ff4 ls25">B.</span><span class="ff1">原物料需求<span class="_"> </span><span class="ff4 ls1d ws14">BOM-Bill of Material<span class="_ _2"> </span></span><span class="ff4"> </span></span></div><div class="t m0 x1 h6 y23 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">根据上述资料审查分析后<span class="_"> </span>由<span class="_ _1"> </span><span class="ff4 ls1f">BOM<span class="_"> </span></span>的展开<span class="_"> </span>来决定原物料的厂牌<span class="_"> </span>种类及规格<span class="_"> </span>主</span></div><div class="t m0 x1 h5 y24 ff1 fs3 fc1 sc0 ls0 ws0">要的原物料包括了<span class="_ _11"> </span>基板<span class="_ _11"> </span><span class="ff4 lse">Laminate<span class="_ _12"> </span></span>胶片<span class="_ _11"> </span><span class="ff4 ls1d">Prepreg<span class="_ _12"> </span></span><span class="ls26">铜箔<span class="_ _11"> </span><span class="ff4 ls19 wsc">Copper foil<span class="_ _12"> </span></span></span>防焊油墨<span class="_ _11"> </span><span class="ff4 ls1e">Solder </span></div><div class="t m0 x1 h5 y25 ff4 fs3 fc1 sc0 ls1d ws0">Mask<span class="_ _13"> </span><span class="ff1 ls0">文字油墨<span class="_ _9"> </span></span><span class="ls1e">Legend<span class="_ _8"> </span><span class="ff1 ls0">等<span class="_"> </span>另外客户对于<span class="_ _0"> </span></span><span class="ls22">Finish<span class="_"> </span><span class="ff1 ls27">的规定</span><span class="ls0">,<span class="ff1">将影响流程的选择</span>,<span class="ff1">当然会有</span></span></span></span></div><div class="t m0 x1 h5 y26 ff1 fs3 fc1 sc0 ls0 ws0">不同的物料需求与规格<span class="_"> </span>例如<span class="_"> </span>软<span class="_"> </span>硬金<span class="_"> </span>喷钖<span class="_"> </span><span class="ff4 ls28">OSP<span class="_"> </span></span>等<span class="_"> </span><span class="ff4 lsf"> </span></div><div class="t m0 x1 h6 y27 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">表归纳客户规范中<span class="_"> </span>可能影响原物料选择的因素<span class="_"> </span><span class="ff4 lsf"> </span></span></div><div class="t m0 x1 h8 y28 ff4 fs4 fc1 sc0 ls0 ws0"> </div><div class="t m0 x3 h9 y29 ff3 fs3 fc1 sc0 ls0 ws0">3 </div></div><div class="pi" data-data='{"ctm":[1.611639,0.000000,0.000000,1.611639,0.000000,0.000000]}'></div></div>
<div id="pf4" class="pf w0 h0" data-page-no="4"><div class="pc pc4 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://csdnimg.cn/release/download_crawler_static/5730397/bg4.jpg"><div class="t m0 x1 h2 y1 ff1 fs0 fc0 sc0 ls0 ws0">资料收藏<span class="_"> </span><span class="ff2 ls1">http://www.maihui.net PCB<span class="_ _0"> </span></span>收藏天地<span class="ff2 ls1"> PCB<span class="_ _0"> </span></span>制造流程及说明<span class="ff2"> </span></div><div class="t m0 x1 h5 y2a ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y30 ff2 fs3 fc1 sc0 ls0 ws0"> <span class="_"> </span><span class="ff4 ls15">C. <span class="_"> </span></span><span class="ff1">上述乃属新数据的审查<span class="ff4">, <span class="_"> </span></span>审查完毕进行样品的制作<span class="ff4">.</span>若是旧资料<span class="ff4">,</span>则须<span class="_ _1"> </span><span class="ff4 ls21">Check<span class="_"> </span></span>有无户</span></div><div class="t m0 x1 h5 y31 ff4 fs3 fc1 sc0 ls1e ws10">ECO (Engineering Change Order) .<span class="ff1 ls0 ws0">再进行审查<span class="ff4 ws3">. </span></span></div><div class="t m0 x1 h5 y32 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y33 ff2 fs3 fc1 sc0 ls0 ws0"> <span class="_"> </span><span class="ff4 ls29">D.</span><span class="ff1">排版<span class="ff4"> </span></span></div><div class="t m0 x1 h5 y34 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y35 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">排版的尺寸选择将影响该料号的获利率</span></div><div class="t m0 x6 h7 y6 ff1 fs3 fc1 sc0 ls0 ws0">因为基板是主要原料成本<span class="_"> </span>排版最佳化<span class="_"> </span>可</div><div class="t m0 x1 h5 y7 ff1 fs3 fc1 sc0 ls0 ws0">减少板材浪费<span class="_ _14"> </span>而适当排版可提高生产力并降低不良率<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 y8 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y9 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">有些工厂认为固定某些工作尺寸可以符合最大生产力<span class="_ _c"> </span>但原物料成本增加很多<span class="ff4">.</span>下列是</span></div><div class="t m0 x1 h5 ya ff1 fs3 fc1 sc0 ls0 ws0">一些考虑的方向<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 yb ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 yc ff1 fs3 fc1 sc0 ls0 ws0">一般制作成本<span class="_"> </span>直<span class="_"> </span>间接原物料约占总成本<span class="_ _1"> </span><span class="ff4 ls13">30~60%<span class="_ _2"> </span></span>包含了基板<span class="_"> </span>胶片<span class="_"> </span>铜箔<span class="_"> </span>防焊</div><div class="t m0 x1 h7 yd ff1 fs3 fc1 sc0 ls0 ws0">干膜<span class="_ _9"> </span>钻头<span class="_ _9"> </span>重金属<span class="_ _9"> </span>铜<span class="_ _9"> </span>钖<span class="_ _9"> </span>铅<span class="_ _13"> </span>化学耗品等<span class="_ _9"> </span>而这些原物料的耗用<span class="_ _9"> </span><span class="ls17">直接和排版尺寸</span></div><div class="t m0 x1 h5 ye ff1 fs3 fc1 sc0 ls0 ws0">恰当与否有关系<span class="_ _10"> </span>大部份电子厂做线路<span class="_ _1"> </span><span class="ff4 ls21">Layout<span class="_ _15"> </span></span>时<span class="_ _10"> </span><span class="ls17">会做连片设计<span class="_ _9"> </span></span>以使装配时能有最高的</div><div class="t m0 x1 h5 yf ff1 fs3 fc1 sc0 ls0 ws0">生产力<span class="_ _10"> </span>因此<span class="_ _10"> </span><span class="ff4 ls9">PCB<span class="_"> </span></span><span class="ls11">工厂之制前设计人员<span class="_ _10"> </span></span>应和客户密切沟通<span class="_ _16"> </span>以使连片<span class="_ _1"> </span><span class="ff4 ls21">Layout<span class="_"> </span></span>的尺寸能</div><div class="t m0 x1 h5 y10 ff1 fs3 fc1 sc0 ls0 ws0">在排版成工作<span class="_ _1"> </span><span class="ff4 ls28">P<span class="_ _d"></span>ANEL<span class="_"> </span><span class="ff1 ls0">时可有最佳的利用率<span class="_"> </span>要计算最恰当的排版<span class="_ _9"> </span>须考虑以下几个因素<span class="_ _b"> </span><span class="ff4"> </span></span></span></div><div class="t m0 x1 h5 y11 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y12 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls16">a.<span class="ff1 ls0">基材裁切最少刀数与最大使用率<span class="_"> </span>裁切方式与磨边处理须考虑进去<span class="_ _14"> </span><span class="ff4"> </span></span></span></div><div class="t m0 x1 h5 y13 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y14 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0">b.<span class="ff1">铜箔<span class="_"> </span>胶片与干膜的使用尺寸与工作<span class="_ _1"> </span></span><span class="ls28">P<span class="_ _d"></span>ANEL<span class="_"> </span><span class="ff1 ls0">的尺寸须搭配良好<span class="_"> </span>以免浪费<span class="_"> </span><span class="ff4"> </span></span></span></span></div><div class="t m0 x1 h5 y15 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y16 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls16">c.<span class="ff1 ls0">连片时<span class="_"> </span></span>piece<span class="_"> </span><span class="ff1 ls0">间最小尺寸<span class="_"> </span>以及板边留做工具或对位系统的最小尺寸<span class="_"> </span><span class="ff4"> </span></span></span></div><div class="t m0 x1 h5 y17 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y18 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0">d.<span class="ff1">各制程可能的最大尺寸限制或有效工作区尺寸</span>. </span></div><div class="t m0 x1 h5 y19 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y1a ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls16">e.<span class="ff1 ls0">不同产品结构有不同制作流程<span class="_"> </span>及不同的排版限制<span class="_"> </span>例如<span class="_"> </span>金手指板<span class="_"> </span>其排版间距</span></span></div><div class="t m0 x1 h5 y1b ff1 fs3 fc1 sc0 ls0 ws0">须较大且有方向的考量<span class="_ _4"> </span>其测试治具或测试次序规定也不一样<span class="_ _4"> </span><span class="ff4"> <span class="_"> </span></span>较大工作尺寸<span class="_ _4"> </span>可以符合</div><div class="t m0 x1 h5 y1c ff1 fs3 fc1 sc0 ls0 ws0">较大生产力<span class="_"> </span>但原物料成本增加很多<span class="ff4">,</span>而且设备制程能力亦需提升<span class="_"> </span>如何取得一个平衡点</div><div class="t m0 x1 h5 y1d ff1 fs3 fc1 sc0 ls0 ws0">设计的准则与工程师的经验是相当重要的<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 y1e ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y1f ff4 fs3 fc1 sc0 ls0 ws0">2.3.3 <span class="_"> </span><span class="ff1">着手设计</span><span class="lsf"> </span></div><div class="t m0 x1 h5 y20 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y21 ff1 fs3 fc1 sc0 ls0 ws0">所有数据检核齐全后<span class="_"> </span>开始分工设计<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 y22 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y23 ff2 fs3 fc1 sc0 ls0 ws0"> <span class="_"> </span><span class="ff4 ls10">A. <span class="_"> </span></span><span class="ff1">流程的决定<span class="ff4 lsd ws4">(Flow Chart) <span class="_"> </span></span><span class="ls7">由数据审查的分析确认后<span class="_ _16"> </span></span>设计工程师就要决定最适切的流</span></div><div class="t m0 x1 h5 y24 ff1 fs3 fc1 sc0 ls0 ws0">程步骤<span class="_ _17"> </span><span class="ff4"> <span class="_"> </span></span>传统多层板的制作流程可分作两个部分<span class="ff4">:</span>内层制作和外层制作<span class="ff4">.</span>以下图标几种代<span class="ff4"> <span class="_"> </span></span>表</div><div class="t m0 x1 h5 y25 ff1 fs3 fc1 sc0 ls0 ws0">性流程供参考<span class="ff4">.</span>见图<span class="_ _1"> </span><span class="ff4">2.3 <span class="_"> </span></span>与<span class="ff4"> <span class="_"> </span></span>图<span class="_ _1"> </span><span class="ff4 ws3">2.4 </span></div><div class="t m0 x1 h5 y26 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y27 ff2 fs3 fc1 sc0 ls0 ws0"> <span class="_"> </span><span class="ff4 ls2a ws1c">B. CAD/CAM<span class="_"> </span></span><span class="ff1">作业<span class="ff4 lsf"> </span></span></div><div class="t m0 x1 h8 y28 ff4 fs4 fc1 sc0 ls0 ws0"> </div><div class="t m0 x3 h9 y29 ff3 fs3 fc1 sc0 ls0 ws0">4 </div></div><div class="pi" data-data='{"ctm":[1.611639,0.000000,0.000000,1.611639,0.000000,0.000000]}'></div></div>
<div id="pf5" class="pf w0 h0" data-page-no="5"><div class="pc pc5 w0 h0"><img class="bi x0 y0 w1 h1" alt="" src="https://csdnimg.cn/release/download_crawler_static/5730397/bg5.jpg"><div class="t m0 x1 h2 y1 ff1 fs0 fc0 sc0 ls0 ws0">资料收藏<span class="_"> </span><span class="ff2 ls1">http://www.maihui.net PCB<span class="_ _0"> </span></span>收藏天地<span class="ff2 ls1"> PCB<span class="_ _0"> </span></span>制造流程及说明<span class="ff2"> </span></div><div class="t m0 x1 h5 y2a ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y30 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls11">a. <span class="_"> </span><span class="ff1 ls0">将<span class="_ _1"> </span></span><span class="ws12">Gerber Data <span class="_"> </span></span><span class="ff1 ls0">输入所使用的<span class="_ _1"> </span></span><span class="ls1f">CAM<span class="_"> </span><span class="ff1 ls0">系统</span></span></span></div><div class="t m0 x7 h5 y2c ff1 fs3 fc1 sc0 ls0 ws0">此时须将<span class="_ _1"> </span><span class="ff4 ls16">apertures<span class="_"> </span></span>和<span class="_ _1"> </span><span class="ff4 ls12">shapes<span class="_"> </span></span>定义好<span class="_"> </span>目</div><div class="t m0 x1 h5 y2d ff1 fs3 fc1 sc0 ls0 ws0">前<span class="_ _b"> </span>己有很多<span class="_ _18"> </span><span class="ff4 ls10 wsd">PCB CAM<span class="_ _18"> </span></span><span class="ls1b">系统可接受<span class="_ _18"> </span><span class="ff4 ls21">IPC-350<span class="_ _18"> </span></span></span>的格式<span class="_ _b"> </span>部份<span class="_ _18"> </span><span class="ff4 ls1f">CAM<span class="_ _18"> </span></span>系统可产生外型<span class="_ _18"> </span><span class="ff4 ls12 ws8">NC Routing </span></div><div class="t m0 x1 h5 y2e ff1 fs3 fc1 sc0 ls0 ws0">档<span class="_ _19"> </span>不过一般<span class="_ _1"> </span><span class="ff4 ls17 wsb">PCB Layout<span class="_"> </span></span>设计软件并不会产生此文件<span class="_ _19"> </span><span class="ff4"> <span class="_"> </span></span>有部份专业软件或独立或配合<span class="_ _1"> </span><span class="ff4 ls1f">NC </span></div><div class="t m0 x1 h5 y4 ff4 fs3 fc1 sc0 ls19 ws0">Router<span class="_ _3"></span>,<span class="ff1 ls0">可设定参数直接输出程序<span class="ff4 ws3">. </span></span></div><div class="t m0 x1 h5 y5 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y6 ff2 fs3 fc1 sc0 ls0 ws0"> <span class="_"> </span><span class="ff4"> <span class="_"> </span></span> <span class="_"> </span><span class="ff4 ls1e">Shapes <span class="_"> </span></span><span class="ff1">种类有圆<span class="_ _16"> </span>正方<span class="_ _9"> </span>长方<span class="ff4">,</span>亦有较复杂形状<span class="_ _9"> </span>如内层之<span class="_ _1"> </span><span class="ff4 ls1a ws1d">thermal pad<span class="_"> </span></span>等<span class="_ _16"> </span>着手设计</span></div><div class="t m0 x1 h5 y7 ff1 fs3 fc1 sc0 ls0 ws0">时<span class="_"> </span><span class="ff4 ls11 ws12">Aperture code<span class="_"> </span></span>和<span class="_ _1"> </span><span class="ff4 ls12">shapes<span class="_"> </span></span>的关连要先定义清楚<span class="_"> </span>否则无法进行后面一系列的设计<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 y8 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y9 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0">b. <span class="_"> </span><span class="ff1">设计时的<span class="_ _1"> </span></span><span class="ls1d ws14">Check list <span class="_"> </span> </span></span></div><div class="t m0 x1 h6 ya ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">依据<span class="_ _1"> </span><span class="ff4 lse ws5">check list<span class="_"> </span></span>审查后<span class="_"> </span>当可知道该制作料号可能的良率以及成本的预估<span class="_"> </span><span class="ff4"> </span></span></div><div class="t m0 x1 h5 yb ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 yc ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 lsd ws4">c. W<span class="_ _d"></span>orking Panel<span class="_"> </span><span class="ff1 ls0 ws0">排版注意事项<span class="_"> </span><span class="ff4 lsf"> </span></span></span></div><div class="t m0 x1 h5 yd ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 ye ff2 fs3 fc1 sc0 ls8 ws0"> <span class="_"> </span><span class="ff4 ls1e ws10">PCB Layout<span class="_"> </span></span><span class="ff1 ls0">工程师在设计时<span class="_ _16"> </span>为协助提醒或注意某些事项<span class="_ _9"> </span>会做一些辅助的记号做</span></div><div class="t m0 x1 h5 yf ff1 fs3 fc1 sc0 ls0 ws0">参考<span class="_"> </span>所以必须在进入排版前<span class="_"> </span>将之去除<span class="_"> </span>下表列举数个项目<span class="_"> </span>及其影响<span class="_"> </span><span class="ff4 lsf"> </span></div><div class="t m0 x1 h5 y10 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y11 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="_"> </span><span class="ff1 ls0">排版的尺寸选择将影响该料号的获利率<span class="_"> </span>因为基板是主要原料成本<span class="_"> </span>排版最佳化</span></div><div class="t m0 x1 h5 y12 ff1 fs3 fc1 sc0 ls0 ws0">可减少板材浪费<span class="_ _14"> </span>而适当排版可提高生产力并降低不良率<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 y13 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y14 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff1 ls0">有些工厂认为固定某些工作尺寸可以符合最大生产力<span class="_ _c"> </span>但原物料成本增加很多<span class="ff4">.</span>下列是</span></div><div class="t m0 x1 h5 y15 ff1 fs3 fc1 sc0 ls0 ws0">一些考虑的方向<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 y16 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h5 y17 ff1 fs3 fc1 sc0 ls0 ws0">一般制作成本<span class="_"> </span>直<span class="_"> </span>间接原物料约占总成本<span class="_ _1"> </span><span class="ff4 ls13">30~60%<span class="_ _2"> </span></span>包含了基板<span class="_"> </span>胶片<span class="_"> </span>铜箔<span class="_"> </span>防焊</div><div class="t m0 x1 h7 y18 ff1 fs3 fc1 sc0 ls0 ws0">干膜<span class="_ _9"> </span>钻头<span class="_ _9"> </span>重金属<span class="_ _8"> </span>铜<span class="_ _9"> </span>钖<span class="_ _9"> </span>铅<span class="_ _8"> </span>金<span class="_ _13"> </span>化学耗品等<span class="_ _9"> </span>而这些原物料的耗用<span class="_ _9"> </span>直接和排版</div><div class="t m0 x1 h5 y19 ff1 fs3 fc1 sc0 ls0 ws0">尺寸恰当与否有关系<span class="_ _10"> </span>大部份电子厂做线路<span class="_ _1"> </span><span class="ff4 ls21">Layout<span class="_ _15"> </span></span>时<span class="_ _10"> </span>会做连片设计<span class="_ _16"> </span>以使装配时能有最</div><div class="t m0 x1 h5 y1a ff1 fs3 fc1 sc0 ls0 ws0">高的生产力<span class="_ _10"> </span>因此<span class="_ _10"> </span><span class="ff4 ls9">PCB<span class="_"> </span></span>工厂之制前设计人员<span class="_ _10"> </span>应和客户密切沟通<span class="_ _16"> </span>以使连片<span class="_ _1"> </span><span class="ff4 ls21">Layout<span class="_"> </span></span>的尺</div><div class="t m0 x1 h5 y1b ff1 fs3 fc1 sc0 ls0 ws0">寸能在排版成工作<span class="_ _1"> </span><span class="ff4 ls28">P<span class="_ _d"></span>ANEL<span class="_"> </span><span class="ff1 ls0">时可有最佳的利用率<span class="_"> </span>要计算最恰当的排版<span class="_"> </span>须考虑以下几个</span></span></div><div class="t m0 x1 h5 y1c ff1 fs3 fc1 sc0 ls0 ws0">因素<span class="_"> </span><span class="ff4"> </span></div><div class="t m0 x1 h5 y1d ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y1e ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0">1.<span class="ff1">基材裁切最少刀数与最大使用率<span class="_"> </span>裁切方式与磨边处理须考虑进去<span class="_ _14"> </span></span> </span></div><div class="t m0 x1 h5 y1f ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y20 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0">2.<span class="ff1">铜箔<span class="_"> </span>胶片与干膜的使用尺寸与工作<span class="_ _1"> </span></span><span class="ls28">P<span class="_ _d"></span>ANEL<span class="_"> </span><span class="ff1 ls0">的尺寸须搭配良好<span class="_"> </span>以免浪费<span class="_"> </span><span class="ff4"> </span></span></span></span></div><div class="t m0 x1 h5 y21 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y22 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0">3.<span class="ff1">连片时<span class="_"> </span></span><span class="ls16">piece<span class="_"> </span></span><span class="ff1">间最小尺寸<span class="_"> </span>以及板边留做工具或对位系统的最小尺寸<span class="_"> </span></span> </span></div><div class="t m0 x1 h5 y23 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y24 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0">4.<span class="ff1">各制程可能的最大尺寸限制或有效工作区尺寸</span><span class="ws3">. </span></span></div><div class="t m0 x1 h5 y25 ff4 fs3 fc1 sc0 ls0 ws0"> </div><div class="t m0 x1 h6 y26 ff2 fs3 fc1 sc0 ls8 ws0"> <span class="ff4 ls0">5<span class="_"> </span><span class="ff1">不同产品结构有不同制作流程<span class="_"> </span>及不同的排版限制<span class="_"> </span>例如<span class="_"> </span>金手指板<span class="_"> </span>其排版间距</span></span></div><div class="t m0 x1 h5 y27 ff1 fs3 fc1 sc0 ls0 ws0">须较大且有方向的考量<span class="_"> </span>其测试治具或测试次序规定也不一样<span class="_"> </span><span class="ff4 lsf"> </span></div><div class="t m0 x1 h8 y28 ff4 fs4 fc1 sc0 ls0 ws0"> </div><div class="t m0 x3 h9 y29 ff3 fs3 fc1 sc0 ls0 ws0">5 </div></div><div class="pi" data-data='{"ctm":[1.611639,0.000000,0.000000,1.611639,0.000000,0.000000]}'></div></div>
PCB设计资料大全，工程师必备
